430801-501 Laird Connectivity

CP Series CP10-31-05 A Thermoelectric Modules The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered the standard in the thermoelectric industry. This broad product line of high-performance and highly reliable TEMs is available in numerous heat pumping capacities, geometric shapes, and input power ranges. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the CP Series is designed for higher current and large heat-pumping applications. FEATURES APPLICATIONS Precise Temperature Control Medical Lasers Compact Geometric Sizes Lab Science Instrumentation Reliable Solid-State Operation Clinical Diagnostic Systems No Sound or Vibration Photonics Laser Systems Environmentally Friendly Electronic Enclosure Cooling DC Operation Food & Beverage Cooling RoHS Compliant Chillers (Liquid Cooling) TECHNICAL SPECIFICATIONS Hot Side Temperature (C) 25 50 Qmax (W) 8.2 9.2 Delta Tmax (C) 67 75 Imax (Amps) 3.9 3.9 Vmax (Volts) 3.8 4.0 Module Resistance (Ohms) 0.82 0.92 SUFFIX THICKNESS (PRIOR TO THINNING) FLATNESS & PARALLELISM HOT FACE COLD FACE LEAD LENGTH L 0.1260.010 0.0015/0.0015 Lapped Lapped 4.5 L1 0.1260.001 0.001/0.001 Lapped Lapped 4.5 L2 0.1260.0005 0.0005/0.0005 Lapped Lapped 4.5 ML 0.1300.010 0.002/0.002 Metallized Lapped 4.5 LM 0.1300.010 0.002/0.002 Lapped Metallized 4.5 MM 0.1340.010 0.002/0.002 Metallized Metallized 4.5 SEALING OPTIONS SUFFIX TEMPERATURE RANGE DESCRIPTION SEALANT COLOR RT RTV White -60 to +204 C Non-corrosive, silicone adhesive EP Epoxy Black -55 to +150 C Low density syntactic foam epoxy encapsulant < CP10-31-05 1019 CP10-31-05 Thermoelectric Modules PERFORMANCE CURVES AT Th = 25 C MECHANICAL DRAWING CP10-31-05 1019