X-On Electronics has gained recognition as a prominent supplier of 450-0162C Multiprotocol Modules across the USA, India, Europe, Australia, and various other global locations. 450-0162C Multiprotocol Modules are a product manufactured by Laird Connectivity. We provide cost-effective solutions for Multiprotocol Modules, ensuring timely deliveries around the world.

450-0162C Laird Connectivity

450-0162C electronic component of Laird Connectivity
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Part No.450-0162C
Manufacturer: Laird Connectivity
Category: Multiprotocol Modules
Description: Multiprotocol Modules SIP, Sterling-LWB5
Datasheet: 450-0162C Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 30.6322
50 : USD 26.901
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0
MOQ : 1
Multiples : 1
1 : USD 32.5118
50 : USD 32.4097
N/A

   
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We are delighted to provide the 450-0162C from our Multiprotocol Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 450-0162C and other electronic components in the Multiprotocol Modules category and beyond.

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Sterling-LWB5 Module Datasheet Integrated 802.11 a/b/g/n/ac WLAN, Bluetooth & BLE Module FEATURES DESCRIPTION The Sterling-LWB5 is a high performance 2.4 GHz IEEE 802.11 a/b/g/n/ac (single stream n) and 5 GHz WLAN and Bluetooth Smart Ready Typical WLAN Transmit Power: combo module based on latest-generation silicon o +16 dBm, 11 Mbps, CCK (b) (Cypresss BCM43353). With an industrial o +13 dBm, 54 Mbps, OFDM (g) temperature rating, broad country certifications, o +11 dBm, HT20 MCS7 (n) and the availability of two different package styles, Typical WLAN Sensitivity: the Sterling-LWB5 provides significant flexibility to o -87 dBm, 8% PER,11 Mbps (b) meet various end user application needs. o -73 dBm, 10% PER, 54 Mbps (g) o -71 dBm, 10% PER, MCS7 (n) The on-module chip antenna package style for the Bluetooth 2.1+EDR, Bluetooth 3.0, Sterling-LWB5 eliminates complexity for design Bluetooth 4.2 (Bluetooth Low Energy) integration, simplifies manufacturing assembly with WLAN and Bluetooth coexistence larger pin outs, and features an advanced chip Available in two footprint styles: antenna that offers greater resistance to de-tuning o Easy to Integrate: 15.5 mm x 21 mm than typical trace or chip antennas. o Miniature footprint: 10 mm x 10 mm Available with integrated chip antenna or U.FL connector for external antenna Operating voltage: VBAT = 3.20V to 3.60V VDDIO = 1.71V to 1.89V o Operating temperature: -40 to +85 C Compact design based on Cypress BCM43353 SoC EMC Compliance: FCC (USA), IC (Canada), & ETSI (Europe) BT SIG QDID: 97564 REACH and RoHS compliant The module includes the MAC, Baseband and Radio to support WLAN applications and an independent, APPLICATIONS high-speed UART is provided for the Bluetooth host interface. In addition, the latest Linux and Android Security & Building Automation drivers are supported directly by LSR and Cypress. Internet of Things / M2M Connectivity Need to get to market quickly Not an expert in Smart Gateways 802.11. Need a custom antenna Would you like to own the design Would you like a custom design Not quite sure what you need Do you need help with your host board LSR Design Services will be happy to develop custom hardware or software, or assist with integrating the design. Contact us at sales lsr.com or call us at 262-375-4400. The information in this document is subject to change without notice. 330-0208-R2.1 Copyright 2016-2018 LSR Page 1 of 80 Sterling-LWB5 Module Datasheet TABLE OF CONTENTS FEATURES ................................................................................................................................... 1 APPLICATIONS ............................................................................................................................ 1 DESCRIPTION .............................................................................................................................. 1 MODULE VARIANTS .................................................................................................................... 5 FUNCTIONAL FEATURES .............................................................................................................. 8 WLAN Features ...................................................................................................................................................... 8 Bluetooth Features ................................................................................................................................................ 8 Wireless Security System Features ........................................................................................................................ 8 ORDERING INFORMATION .......................................................................................................... 9 MODULE ACCESSORIES .............................................................................................................. 10 APPLICABLE DOCUMENTS ......................................................................................................... 10 BLOCK DIAGRAMS ..................................................................................................................... 11 SIP MODULE FOOTPRINT AND PIN DEFINITIONS ........................................................................ 14 SIP MODULE PIN DESCRIPTIONS ................................................................................................ 15 U.FL AND CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS ...................................... 18 U.FL AND CHIP ANTENNA MODULE PIN DESCRIPTIONS .............................................................. 19 MODULE POWER STATES .......................................................................................................... 21 MODULE PIN I/O STATES ........................................................................................................... 22 ELECTRICAL SPECIFICATIONS ..................................................................................................... 25 Absolute Maximum Ratings ................................................................................................................................. 25 Recommended Operating Conditions .................................................................................................................. 25 General Characteristics ........................................................................................................................................ 26 WLAN Power Consumption.................................................................................................................................. 27 Bluetooth Power Consumption ............................................................................................................................ 28 Power Supply Requirements ................................................................................................................................ 28 Power Supply Sequencing .................................................................................................................................... 29 The information in this document is subject to change without notice. 330-0208-R2.1 Copyright 2016-2018 LSR Page 2 of 80

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
Laird / LS Research
Laird Connectivity
Laird Technologies EMI
Laird Technologies IAS
Laird Technologies Wireless M2M
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