Ceramic Plate Series CP08,31,06 Thermoelectric Modules Innovative Technology for a Connected World The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered the standard in the thermoelectric industry. This broad product line of high-performance and highly reliable TEMs is available in numerous heat pumping capacities, geometric shapes, and input power ranges. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the CP Series is designed for higher current and large heat-pumping applications. FeatureS aPPliCationS Precise Temperature Control Medical Lasers Compact Geometric Sizes Lab Science Instrumentation Reliable Solid State Operation Clinical Diagnostic Systems No Sound or Vibration Photonics Laser Systems Environmentally Friendly Electronic Enclosure Cooling DC Operation Food & Beverage Cooling RoHS Compliant Chillers (Liquid Cooling) perforMance Specifica TionS hot Side Temperature (c) 25C 50C Qmax (Watts) 4.5 4.9 delta Tmax (c) 67 75 imax (amps) 2.1 2.1 Vmax (Volts) 3.7 4.0 Module resistance (ohms) 1.54 1.74 Suffix ThickneSS laf TneSS & ho T cold lead (prior To Tinning) paralleliSM f ace f ace length l 0.134 0.010 0.0015 / 0.0015 Lapped Lapped 4.5 l1 0.134 0.001 0.001 / 0.001 Lapped Lapped 4.5 l2 0.134 0.0005 0.0005 / 0.0005 Lapped Lapped 4.5 Ml 0.138 0.010 0.002 / 0.002 Metallized Lapped 4.5 lM 0.138 0.010 0.002 / 0.002 Lapped Metallized 4.5 MM 0.142 0.010 0.002 / 0.002 Metallized Metallized 4.5 Sealing oPtion Suffix SealanT color TeMp range deScripTion rT RTV White -60 to 204 C Non-corrosive, silicone adhesive sealant ep Epoxy Black -55 to 150 C Low density syntactic foam epoxy encapsulant global solutions: local support TM Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 clv.customerpos lairdtech.com www.lairdtech.comCeramic Plate Series CP08,31,06 Thermoelectric Modules Innovative Technology for a Connected World Performance Curves at Th = 25C thermo eleCtriC Delta T (C) Delta T (C) HEAT SHRINK TUBING (2 PLACES) HOT SIDE (SEE OPTIONS) oPerating tiPS Max Operating Temperature: 80C Reference assembly guidelines for recommended installation Do not exceed Imax or Vmax when Solder tinning also available on operating module metallized ceramics CP08,31,06 0209 Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request. For further information please visit our website at www.lairdtech.com Alternatively contact: sales lairdtech.com. Bluetooth is a trademark owned by Bluetooth SIG, Inc., USA and licensed to Laird Technologies. 2008 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc. Qc (W) Voltage (V)