A10096-01 Laird Connectivity

Tpli 200 Series Thermal Gap Filler PRODUCT DESCRIPTION TM Tpli 200 is a premium gap filler. A unique blend of boron nitride and silicone produce the highest performing interface pad. Tpli 200s exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. Tpli 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. Tpli 200 is electrically insulating, stable from -45C to 200C, and meets UL 94 HB rating. *Ready for 5G FEATURES AND BENEFITS Soft and compliant High Thermal performance Environmentally friendly solution that meets regulatory requirements including RoHS and REACH SPECIFICATIONS TYPICAL PROPERTIES TYPICAL VALUE TEST METHOD Construction & Composition Boron nitride filled silicone N/A sheet Color Varies by thickness Visual Thickness Range 0.25mm (0.010) - 5.08mm N/A (0.20) Thickness Tolerance +/- 10% N/A Thermal Conductivity (W/mK) 6.0 ASTM D5470 Density (g/cc) 1.4 Helium Pyncometer Hardness (Shore 00) 70 ASTM D2240 Outgassing TML (weight %) 0.51 ASTM E595 Outgassing CVCM (weight %) 0.17 ASTM E595 Temperature Range -45C to 200C N/A 0 Rth 40 mils, 10 psi, 50 C 0.25Cin2/W ASTM D5470 (modified) * Dielectric Constant 10GHz 3.2 * ASTM D150 UL Flammability Rating HB UL 94 Volume Resistivity 5x10 13 ohm-cm ASTM D257 Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com Tpli 200 Series Thermal Gap Filler AVAILABILITY STANDARD THICKNESSES 0.25mm (0.010) to 5.0mm (0.200) thick material available in 0.25mm (0.010) increments Available in standard sheet sizes of 18 x 18 and 9 x 9 or custom die cut parts REINFORCEMENT Fiberglass is required in thicknesses of 0.010 (0.25mm) and 0.015 (0.38mm) Reinforcement is optional in thicknesses 0.020 (0.5mm) and 0.025 (0.63mm). Indicate fiberglass by FG suffix Thicknesses above 0.025 (0.063mm) are not reinforced OPTIONS A0 - no adhesive A1 adhesive on one side POST CURE Post Curing option available. Indicate fiberglass by PC suffix PART NUMBER SYSTEM Tflex indicates Laird elastomeric thermal gap filler product line. Tpli 2xx indicates Tpli 200 product line with thickness in mils (0.001) EXAMPLES: Tpli 240,A0 = 0.040 inch thick Tpli 200 material with no adhesive Tpli 280,A1 = 0.080 inch thick Tpli 200 material with one side adhesive Tpli 220FG,A1 = 0.020 inch thick Tpli 200 material with fiberglass reinforcement and one side adhesive Tpli 260,PC = 0.060 inch thick Tpli 200 material post cured Tpli 200 DS 071718 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.