TM Tflex 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this gap filler produces low thermal resistance. The alumina filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable. Naturally tacky and not requiring additional adhesive coating, the Tflex 200 V0 can inhibit thermal performance. This gap filler is both electrically insulating and stable from -40C to 160C and meets UL 94 VO rating. FEATURES AND BENEFITS Soft and compressible for low stress applications Naturally tacky needing no further adhesive coating 1.1 W/mK thermal conductivity Available in thicknesses from 0.010 (0.25mm) to 0.200 (5.0mm) APPLICATIONS Cooling components to the chassis or frame High speed mass storage drives RDRAM memory modules Heat pipe thermal solutions Automotive engine control units Wireless communication hardware global solutions: local support TM Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice lairdtech.com www.lairdtech.com/thermalTM Tflex 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World Tflex 220 V0 Tflex 240 V0 Tflex 260 V0 Tflex 280 V0 Tflex 2100 V0 TEST METHOD Construction & Reinforced ceramic filled Ceramic filled Ceramic filled Ceramic filled Ceramic filled Composition silicone elastomer silicone elastomer silicone elastomer silicone elastomer silicone elastomer Color Light Gray Light Gray Light Gray Light Gray Light Gray Visual Thickness 0.02 (0.508mm) 0.04 (1.016mm) 0.06 (1.524mm) 0.08 (2.032mm) 0.10 (2.54mm) 0.002 0.004 0.006 0.008 0.010 Thickness Tolerance ( 0.05mm) ( 0.10mm) ( 0.15mm) ( 0.20mm) ( 0.25mm) 3 3 3 3 3 Density 1.75 g/cm 1.73 g/cm 1.73 g/cm 1.73 g/cm 1.73 g/cm Helium Pycnometer Hardness 50 Shore 00 45 Shore 00 45 Shore 00 45 Shore 00 45 Shore 00 ASTM D2240 Tensile Strength 464 psi 48 psi 48 psi 48 psi 48 psi ASTM D412 % Elongation 10.5 63.0 60.6 60.6 60.6 ASTM D412 Outgassing TML 0.34% 0.34% 0.34% 0.34% 0.34% ASTM E595 (Post Cured) Outgassing CVCM 0.10% 0.10% 0.10% 0.10% 0.10% ASTM E595 (Post Cured) UL Flammability Rating 94 VO 94 VO 94 VO 94 VO 94 VO E180840 Temperature Range -45C to 160C -45C to 160C -45C to 160C -45C to 160C -45C to 160C ASTM D5470 Thermal Conductivity 1.1 W/mK 1.1 W/mK 1.1 W/mK 1.1 W/mK 1.1 W/mK (modified) Total Thermal 2 2 2 2 2 Resistance 0.80 C-in /W 1.57 C-in /W 2.05 C-in /W 2.51 C-in /W 2.93 C-in /W ASTM D5470 2 2 2 2 2 10 psi 5.13 C-cm /W 10.13 C-cm /W 13.23 C-cm /W 16.19 C-cm /W 18.90 C-cm /W (modified) 69KPa Coefficient of 229 ppm/C 229 ppm/C 229 ppm/C 229 ppm/C 229 ppm/C IPC-TM-650 Thermal Expansion 35C to 130C 35C to 130C 35C to 130C 35C to 130C 35C to 130C 2.4.24 Breakdown Voltage 12,000 Volts AC >27,000 Volts >27,000 Volts >27,000 Volts >27,000 Volts ASTM D149 13 13 13 13 13 Volume Resistivity 4 x 10 ohm-cm 4 x 10 ohm-cm 4 x 10 ohm-cm 4 x 10 ohm-cm 4 x 10 ohm-cm ASTM D257 Dielectric Constant 5.5 5.5 5.5 5.5 5.5 1MHz STANDARD THICKNESSES STANDARD SHEET SIZES 0.020 (0.51mm) 0.030 (0.76mm) 0.040 (1.02mm) 0.050 (1.27mm) 9 x 9 (229mm x 229mm) Tflex 200V0 may be die cut into individual 0.060 (1.52mm) 0.070 (1.78mm) 0.080 (2.03mm) 0.090 (2.29mm) shapes. Pressure sensitive adhesive is not applicable for Tflex products. 0.100 (2.54mm) 0.110 (2.79mm) 0.120 (3.05mm) 0.130 (3.30mm) 0.140 (3.56mm) 0.150 (3.81mm) 0.160 (4.06mm) 0.170 (4.32mm) REINFORCEMENT 0.180 (4.57mm) 0.190 (4.83mm) 0.200 (5.08mm) 0.020 (0.51mm) and 0.030 (0.762mm) are fiberglass reinforced. Consult the factory for alternate thicknesses Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. THR-DS-Tflex-200V0 0710 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and ap- plication of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A14175-00 Rev. G, 08/13/08