X-On Electronics has gained recognition as a prominent supplier of A14565-01 Thermal Interface Products across the USA, India, Europe, Australia, and various other global locations. A14565-01 Thermal Interface Products are a product manufactured by Laird Connectivity. We provide cost-effective solutions for Thermal Interface Products, ensuring timely deliveries around the world.

A14565-01 Laird Connectivity

A14565-01 electronic component of Laird Connectivity
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Part No.A14565-01
Manufacturer: Laird Connectivity
Category: Thermal Interface Products
Description: Thermal Interface Products Tflex 5110 9x9" 2.8W/mK gap filler
Datasheet: A14565-01 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 114.4836 ea
Line Total: USD 114.48 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ : 1
Multiples : 1
1 : USD 114.4836
10 : USD 112.266
25 : USD 111.8271
50 : USD 109.829
100 : USD 108.8702
250 : USD 107.9232
500 : USD 107.8886
1000 : USD 107.877
2500 : USD 107.8539

   
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We are delighted to provide the A14565-01 from our Thermal Interface Products category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the A14565-01 and other electronic components in the Thermal Interface Products category and beyond.

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TM Tflex 500 Series Thermal Gap Filler Innovative Technology for a Connected World CoMplianT 2.8 W/ mK TherMally ConduCTive Gap Filler Tflex 500 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts. Tflex 500s unique silicone and filler combination has extremely low silicone extractables compared to many other silicone interface products. Tflex 500 meets NASA outgassing specification. Tflex 500 is naturally tacky, no adhesive coating is required. Tflex 500 is electrically insulating, stable from -50C to 200C and is certified to UL 94V0 flammability rating. FeaTureS and BeneFiTS Thermal conductivity 2.8 W/mK Highly compliant and cost effective Low thermal resistance even at low pressure Available in thicknesses from 0.020-inch (0.25mm) through 0.200-inch (5.0mm) in 0.010-inch increments Naturally tacky for easy assembly Low silicone extractables appliCa TionS Cooling components to chassis Telecommunication hardware Thermal module for notebook computer LED solid state lighting Power electronics Computer servers Graphics cards Gaming systems LCD and PDP flat panel displays Industrial automation equipment Wireless infrastructure Fragile ASIC components Automotive engine control IT devices Military electronics global solutions: local support TM Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice lairdtech.com www.lairdtech.com/thermalTM Tflex 500 Series Thermal Gap Filler Innovative Technology for a Connected World TM Tflex 500 Tpy i Cal prpo er TieS Thermal Gap Filler Preliminary TM Tflex 500 Thermal Resistance verse Pressure Tflex 500 TEST METHOD Preliminary 2.0 5200 Filled silicone 5160 Construction NA 1.5 elastomer 5120 5100 Color Light Blue Visual 1.0 580 560 Thermal Conductivity 2.8 W/mK ASTM D5470 540 0.5 520 40 Hardness (Shore 00) ASTM D2240 (at 3 second delay) 0.0 0 10 20 30 40 50 60 70 80 Helium Pressure (psi, 1 psi = 6.9 KPa) Density 3.0 g/cc Pycnometer Tflex 500 Defection verse Pressure (ASTM D575) Standard Thickness 0.020 - 0.200 80% Range (0.5 - 5.1mm) 70% 5200 Thickness Tolerance 10% 60% 5160 5120 50% UL Flammability Rating 94 V0 UL 5100 40% 580 Temperature Range -50C to 200C NA 30% 560 Volume Resistivity 10 13 ohm-cm ASTM D257 540 20% 520 Outgassing TML 0.29% ASTM E595 10% 0% Outgassing CVCM 0.04% ASTM E595 0 10 20 30 40 50 60 70 80 90 100 110 Pressure (psi, 1 psi = 6.9 KPa) Coefficient Thermal 37.4 ppm/C IPC-TM-650 Expansion (CTE) 70C-130C 2.4.24 STandard ThiCKneSSeS 0.020 to 0.200-inch (0.25 to 5.0mm). 0.020 to 0.030-inch (0.5 to 0.76mm) thick material come standard with fiberglass reinforcement. 0.020 through 0.200 thick material available in 0.010-inch (0.25mm) increments. opTionS Proprietary DC1 option available to eliminate tack from top side to aid in handling. MaTerial naMe and ThiCKneSS Tflex indicates Laird Technologies brand thermally conductive elastomeric gap filler product. 5xxx indicates 500 series 2.8 W/mK material, and xxx indicates thickness in -mil (0.001-inches) -DC1 designates proprietary tack eliminating option Examples: Tflex 5120 = 0.120-inch thick material Tflex 5120-DC1 = 0.0120-inch thick material with proprietary DC1 option THR-DS-Tflex-500 0110 Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies domestic terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request.damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies domestic terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request. Document A15958-00 Rev B, 11/2009. 2010 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc. % Deflection Thermal Resistance (C-in2/W)

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
Laird / LS Research
Laird Connectivity
Laird Technologies EMI
Laird Technologies IAS
Laird Technologies Wireless M2M
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