A15340-01 Laird Connectivity

Tflex 300 Series Thermal Gap Filler Product Description Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex 300H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liners lower coefficient of friction also allows for easy assembly of parts *Ready for 5G that must slide together, such as a card into a chassis. Tflex 300TG is offered with a cut-through resistant Tgard silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production. FEATURES AND BENEFITS Extreme compliancy allows material to totally blanket components Thermal conductivity of 1.2 W/mK Low compression set enables the pad to be reused many times Environmentally friendly solution that meets regulatory requirements including RoHS and REACH SPECIFICATIONS TYPICAL PROPERTIES VALUE TEST METHOD Construction & Composition Ceramic filled silicone sheet N/A Color Light Green Visual Thickness Range 0.50mm (0.020) - 5.08mm (0.20) N/A Thermal Conductivity (W/mK) 1.2 ASTM D5470 Density (g/cc) 1.78 Helium Pyncometer Hardness (Shore 00) 51.4 (20-30 mil) ASTM D2240 25.2 (40+ mil) Outgassing TML (weight %) 0.56 ASTM E595 Outgassing CVCM (weight %) 0.1 ASTM E595 Temperature Range -40C to 160C N/A 0 Rth 40 mils, 10 psi, 50 C 0.98Cin2/W ASTM D5470 (modified) * Dielectric Constant 10GHz 4.5 * ASTM D150 UL Flammability Rating V-0 UL 94 Volume Resistivity 10 13 ohm-cm ASTM D257 Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com Tflex 300 Series Thermal Gap Filler Tflex 300 Deflection vs Pressure 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi Tflex 340 Tflex 380 Tflex 3120 Tfex 3200 Tflex 300 Thermal Resistance vs Pressure 4.50 C-in2/W 3.75 C-in2/W 3.00 C-in2/W 2.25 C-in2/W 1.50 C-in2/W 0.75 C-in2/W 0.00 C-in2/W 10psi 20psi 30psi 40psi 50psi 60psi Tflex 340 Tflex 380 Tflex 3120 Tflex 3200 AVAILABILITY STANDARD THICKNESSES 0.5mm (0.020) to 5.0mm (0.200) thick material available in 0.25mm (0.010) increments Available in standard sheet sizes of 18 x 18 and 9 x 9 or custom die cut parts OPTIONS DC1 proprietary tack eliminated coating Tgard TG dielectric barrier available to aid in handling and PET dielectric H liner available for applications for easy slide assembly PART NUMBER SYSTEM Tflex indicates Laird elastomeric thermal gap filler product line. 3xxx indicates Tflex 300 product line with thickness in mils (0.001) EXAMPLES: Tflex 340 = 0.040 inch thick Tflex 300 material Tflex 380DC1 = 0.080 inch thick Tflex 300 material with DC1 coating Tflex 3120TG = 0.120 inch thick Tflex 300 material with Tgard liner Tflex 3200H = 0.200 inch thick Tflex 300 material with hard PET liner A15293-00 Tflex 300 DS 071718 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.