TM Tflex HR400 Series Thermal Gap Filler Innovative Technology for a Connected World MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex HR400s recovery properties for applications requiring material rework result in continued mechanical integrity even after device rework and re-assembly. Tflex HR400 is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and component transport. Tflex HR400 is electrically insulating, stable from -50C thru 160C, and meets UL 94V0 flame rating. FEATURES AND BENEFITS Thermal Conductivity 1.8 W/mK Soft and Compliant Available in thicknesses from 0.020 thru 0.400 (0.5mm thru 10.2mm) Naturally tacky for adhesion during assembly and transport APPLICATIONS Cooling components to chassis, frame, or other mating components Memory Modules Home and small office network equipment Mass storage devices Automotive electronics Telecommunication hardware Radios LED solid state lighting Power electronics LCD and PDP flat panel TV Set top boxes Audio and video components IT infrastructure GPS navigation and other portable devices Laird-PN: Farnell Description : Tflex HR420 9x9in, thickness = 0.5 mm A15959-02 Tflex HR440 9x9in, thickness = 1.0 mm A15959-04 Tflex HR480 9x9in, thickness = 2.0 mm A15959-08 Tflex HR4160 9x9in, thickness = 4.0 mm A15959-16 global solutions: local support TM Tflex HR4200 9x9in, thickness = 5.0 mm A15959-20 Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice lairdtech.com www.lairdtech.com/thermalTM Tflex HR400 Series Thermal Gap Filler Innovative Technology for a Connected World TM Tflex HR400 TYPICAL PROPERTIES TM Tflex HR400 TEST METHOD Ceramic filled Construction NA silicone elastomer Color Dark Grey Visual Thermal Conductivity 1.8 W/mK ASTM D5470 Hardness (Shore 00) 60 ASTM D2240 Helium Specific Gravity 1.93 Pyncometer 0.020 - .400 Thickness Range (0.5 - 10.2mm) Thickness Tolerance 10% UL Flammability Rating 94 V0 File E180840 See reliability Temperature Range -50C to 160C report Outgassing TML 0.32% ASTM E595 Outgassing CVCM 0.09% ASTM E595 Coefficient Thermal 651 ppm/C IPC-TM-650 Expansion (CTE) 35C-108C 2.4.24 STANDARD THICKNESSES Standard thickness is 0.020-inch (0.5 mm) through 0.400-inch (10.2 mm) and available in 0.010-inch increments. Please contact Laird Technologies for availability of thicknesses above 0.200-inch. OPTIONS Fiberglass is standard in 0.020-inch and 0.030-inch thicknesses to aid in handling and is designated by the suffix -FG. Material is standard with both sides tacky the -DC1 suffix indicates only one side is tacky. MATERIAL NAME AND THICKNESS Tflex indicates Laird Technologies elastomeric thermal gap filler product line. HR4XXX indicates Tflex HR400 product line with thickness in mils (0.001-inches) -DC1 indicates only one side tacky -FG indicates fiberglass reinforcement. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. THR-DS-Tflex-HR400 0711 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsi - bility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2011 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights Document A15958-00 Rev C, 07/2011