TM
Tflex HR400 Series
Thermal Gap Filler
Innovative Technology
for a Connected World
MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK
Tflex HR400 is a cost-effective and compliant gap filler thermal interface material with
excellent thermal performance and great handling for mass-production applications.
The low modulus interface pad conforms to component topography, resulting in little stress
on the components, mating chassis or parts. The softness relieves mechanical stress from
high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex
HR400s recovery properties for applications requiring material rework result in continued
mechanical integrity even after device rework and re-assembly.
Tflex HR400 is naturally tacky on both sides and requires no additional adhesive coating to
inhibit thermal performance. The tack is designed to hold the pad in place during assembly
and component transport.
Tflex HR400 is electrically insulating, stable from -50C thru 160C, and meets UL 94V0
flame rating.
FEATURES AND BENEFITS
Thermal Conductivity 1.8 W/mK
Soft and Compliant
Available in thicknesses from 0.020 thru 0.400 (0.5mm thru 10.2mm)
Naturally tacky for adhesion during assembly and transport
APPLICATIONS
Cooling components to chassis, frame, or other mating components
Memory Modules
Home and small office network equipment
Mass storage devices
Automotive electronics
Telecommunication hardware
Radios
LED solid state lighting
Power electronics
LCD and PDP flat panel TV
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices
global solutions: local support
TM
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermalTM
Tflex HR400 Series
Thermal Gap Filler
Innovative Technology
for a Connected World
TM
Tflex HR400 TYPICAL PROPERTIES
TM
Tflex HR400 TEST METHOD
Ceramic filled
Construction NA
silicone elastomer
Color Dark Grey Visual
Thermal Conductivity 1.8 W/mK ASTM D5470
Hardness (Shore 00) 60 ASTM D2240
Helium
Specific Gravity 1.93
Pyncometer
0.020" - .400"
Thickness Range
(0.5 - 10.2mm)
Thickness Tolerance 10%
UL Flammability Rating 94 V0 File E180840
See reliability
Temperature Range -50C to 160C
report
Outgassing TML 0.32% ASTM E595
Outgassing CVCM 0.09% ASTM E595
Coefficient Thermal 651 ppm/C IPC-TM-650
Expansion (CTE) 35C-108C 2.4.24
STANDARD THICKNESSES
Standard thickness is 0.020-inch (0.5 mm) through 0.400-inch (10.2 mm) and available in 0.010-inch increments.
Please contact Laird Technologies for availability of thicknesses above 0.200-inch.
OPTIONS
Fiberglass is standard in 0.020-inch and 0.030-inch thicknesses to aid in handling and is designated by the suffix -FG. Material is
standard with both sides tacky; the -DC1 suffix indicates only one side is tacky.
MATERIAL NAME AND THICKNESS
Tflex indicates Laird Technologies elastomeric thermal gap filler product line.
HR4XXX indicates Tflex HR400 product line with thickness in mils (0.001-inches); -DC1
indicates only one side tacky; -FG indicates fiberglass reinforcement.
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
THR-DS-Tflex-HR400 0711
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsi -
bility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability
or non-infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential
damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which
will be furnished upon request. Copyright 2011 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are
trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties.
Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. . Document A15958-00 Rev C, 07/2011.
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