TM Tflex HR600 Series Thermal Gap Filler Innovative Technology for a Connected World Mid-Performance Gap Filler with 3 W/mK Tflex HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex HR600s recovery properties for applications requiring material rework result in continued mechanical integrity even after device rework and re-assembly. Tflex HR600 is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and component transport. Tflex HR600 is electrically insulating, stable from -45C thru 200C, and meets UL 94V0 flame rating. Features and Benefits Thermal conductivity 3 W/mK Soft and compliant Available in thicknesses from 0.010 thru 0.200 (0.25mm thru 5.0mm) Naturally tacky for adhesion during assembly and transport Applications Cooling components to chassis, frame, or other mating components Memory modules Home and small office network equipment Mass storage devices Automotive electronics Telecommunication hardware Radios LED solid state lighting Power electronics LCD and PDP flat panel TV Set top boxes Audio and video components IT infrastructure GPS navigation and other portable devices global solutions: local support TM Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice lairdtech.com www.lairdtech.com/thermalTM Tflex HR600 Series Thermal Gap Filler Innovative Technology for a Connected World TM Tflex HR600 Typical Properties TM Tflex HR600 Test Method Filled silicone Construction NA elastomer Color Dark Grey Visual Thermal conductivity 3 W/mK ASTM D5470 40 Hardness (Shore 00) ASTM D2240 (at 3 second delay) Helium Density 2.5 g/cc Pyncometer 0.010 - .200 Thickness range (0.25 - 5.0mm) Thickness tolerance 10% UL flammability rating 94 V0 UL Temperature range -45C to 200C NA Volume resistivity 10 13 ohm-cm ASTM D257 Outgassing TML 0.19% ASTM E595 Outgassing CVCM 0.07% ASTM E595 Coefficient Thermal IPC-TM-650 217 ppm/C Expansion (CTE) 2.4.24 Standard Thicknesses 0.010-inch to 0.200-inch (0.25 to 5.0 mm) 0.010-inch and 0.015-inch thick materials come standard with fiberglass reinforcement designated by the suffix FG Options Proprietary DC1 option available to eliminate tack from one side to aid in handling. Material Name and Thickness Tflex indicates elastomeric gap filler product line HR6xxx indicates high recovery 6 series 3 W/mK material FG desginates Fiberglass (available in 0.010 and 0.015-inch thickness only) DC1 designates proprietary option eliminating tack from one side Examples Tflex HR6120 = 0.120-inch thick material Tflex HR610FG = 0.010-inch thick material with fiberglass reinforecement Tflex HR6120-DC1 = 0.120-inch thick material with proprietary DC1 option THR-DS-Tflex-HR600 1109 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2009 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Document A15999-00 Rev A, 10/2009.