X-On Electronics has gained recognition as a prominent supplier of A16162-02 Thermal Interface Products across the USA, India, Europe, Australia, and various other global locations. A16162-02 Thermal Interface Products are a product manufactured by Laird Connectivity. We provide cost-effective solutions for Thermal Interface Products, ensuring timely deliveries around the world.

A16162-02 Laird Connectivity

A16162-02 electronic component of Laird Connectivity
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Part No.A16162-02
Manufacturer: Laird Connectivity
Category: Thermal Interface Products
Description: Thermal Interface Products Tflex HR420 18x18" 1.8W/mK gap filler
Datasheet: A16162-02 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 45.1027 ea
Line Total: USD 45.1 
Availability - 83
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
83
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 45.1027
10 : USD 38.8773
25 : USD 38.8773
100 : USD 38.8773
250 : USD 38.4961
1000 : USD 38.4846
2500 : USD 38.473

   
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We are delighted to provide the A16162-02 from our Thermal Interface Products category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the A16162-02 and other electronic components in the Thermal Interface Products category and beyond.

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Tflex HR400 Series Thermal Gap Filler PRODUCT DESCRIPTION Tflex HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications. The low modulus interface pad conforms to component topography, resulting in little stress on the components, mating chassis or parts. The softness relieves mechanical stress from high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex HR400s recovery properties for applications requiring material rework result in continued mechanical integrity even after device rework and re-assembly. Tflex HR400 is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and component transport. FEATURES AND BENEFITS Thermal Conductivity 1.8 W/mK Soft and Compliant Available in thicknesses from 0.020 thru 0.400 (0.5mm thru 10.2mm) Naturally tacky for adhesion during assembly and transport Environmentally friendly solution that meets regulatory requirements including RoHS and REACH SPECIFICATIONS TYPICAL PROPERTIES VALUE TEST METHOD Construction & Composition Ceramic filled silicone sheet N/A Color Dark Grey Visual Thickness Range 0.50mm (.020) 8.9mm N/A (0.350) Thickness Tolerance +/- 10% N/A Thermal Conductivity (W/mK) 1.8 ASTM D5470 Density (g/cc) 1.93 Helium Pycnometer Hardness (Shore 00) 53 ASTM D2240 Outgassing TML (weight %) 0.32 ASTM E595 Outgassing CVCM (weight %) 0.09 ASTM E595 Temperature Range -50C to 160C Laird Test Method Rth 40 mils, 10 psi 1.00 Cin2/W ASTM D5470 (Modified) Dielectric Constant 1 MHz 4.81 ASTM D150 UL Flammability Rating V-0 UL 94 13 Volume Resistivity 2 x 10 ohm-cm ASTM D257 Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com Tflex HR400 Series Thermal Gap Filler AVAILABILITY STANDARD THICKNESSES 0.5mm (0.020) to 8.9mm (0.350) thick material available in 0.25mm (0.010) increments Available in standard sheet sizes of 18 x 18 and 9 x 9 or custom die cut parts OPTIONS DC1 proprietary tack eliminating coating Fiberglass is an option in the 0.020-inch and 0.030-inch thicknesses to aid in handling and is designated by the suffix -FG PART NUMBER SYSTEM Tflex indicates Laird elastomeric thermal gap filler product line. HR4xxx indicates Tflex HR400 product line with thickness in mils (0.001) EXAMPLES: Tflex HR440 = 0.040 thick Tflex HR400 material Tflex HR4100,DC1 = 0.10 thick Tflex HR400 material with DC1 coating Tflex HR400 DS 121317 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
Laird / LS Research
Laird Connectivity
Laird Technologies EMI
Laird Technologies IAS
Laird Technologies Wireless M2M
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