X-On Electronics has gained recognition as a prominent supplier of A17774-07 Thermal Interface Products across the USA, India, Europe, Australia, and various other global locations. A17774-07 Thermal Interface Products are a product manufactured by Laird Connectivity. We provide cost-effective solutions for Thermal Interface Products, ensuring timely deliveries around the world.

A17774-07 Laird Connectivity

A17774-07 electronic component of Laird Connectivity
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See Product Specifications
Part No.A17774-07
Manufacturer: Laird Connectivity
Category: Thermal Interface Products
Description: Thermal Interface Products Tflex HD470 DC1 18x18 IN
Datasheet: A17774-07 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 408.1964 ea
Line Total: USD 408.2 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 408.1964
10 : USD 365.722
25 : USD 361.5942
50 : USD 358.1503
100 : USD 351.1527
250 : USD 351.1404

   
Manufacturer
Product Category
RoHS - XON
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the A17774-07 from our Thermal Interface Products category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the A17774-07 and other electronic components in the Thermal Interface Products category and beyond.

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TM Tflex HD400 Series Thermal Gap Filler Product Description Laird Tflex HD400 is a 4.0 W/mK gap filling material in our high deflection line of products. Tflex HD400 is an excellent choice when wide manufacturing tolerances occur. These variable gaps can be filled with Tflex HD400 while generating minimal board and component stress. Lairds unique manufacturing capabilities, filler and resin knowledge result in this advanced product designed with customer applications in mind. Tflex HD400 is provided in thickness from 0.5mm (.020) up to 5mm (0.200) in 0.25mm (.020) increments as standard. In addition, Laird can provide Tflex HD400 in multiple converted formats through approved converters and distribution networks. FEATURES AND BENEFITS 4.0 W/mK thermal conductivity Low pressure versus deflection Excellent surface wetting for low contact resistance Minimizes board and component stress Large tolerance applications RoHS and REACH compliant SPECIFICATIONS TYPICAL PROPERTIES VALUE TEST METHOD Construction & Composition Ceramic filled silicone sheet N/A Color Blue Visual Thickness Range 0.5 mm (0.020) - 5.0mm (0.20) N/A Thermal Conductivity (W/mK) 4.0 ASTM D5470 Density (g/cc) 3.0 Helium Pycnometer Hardness (Shore 00) 44 ASTM D2240 Outgassing TML (weight %) 0.22 ASTM E595 Outgassing CVCM (weight %) 0.04 ASTM E595 Temperature Range -40C to 200C Laird Test Method Rth 40 mils, 10 psi 0.36Cin2/W ASTM D5470 (Modified) Dielectric Constant 1 MHz 10.7 ASTM D150 UL Flammability Rating V-0 UL 94 14 Volume Resistivity 2.8 x 10 ASTM D257 Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com TM Tflex HD400 Series Thermal Gap Filler Tflex HD400 Deflection vs Pressure 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 5 psi 10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi 40 mil 60 mil 140 mil 180 mil 200 mil Tflex HD400 Thermal Resistance vs. Pressure 0.70 C-in2/W 0.60 C-in2/W 0.50 C-in2/W 0.40 C-in2/W 0.30 C-in2/W 0.20 C-in2/W 0.10 C-in2/W 0.00 C-in2/W 0 psi 20 psi 40 psi 60 psi 80 psi 100 psi 40 mil 60 mil 80 mil 100 mil AVAILABILITY STANDARD THICKNESSES 0.5 mm (0.020) to 5.0mm (0.200) thick material available in 0.25mm (0.010) increments Available in standard sheet sizes of 18 x 18 and 9 x 9 or custom die cut parts OPTIONS DC1 eliminate tack from one side PART NUMBER SYSTEM Tflex indicates Laird elastomeric thermal gap filler product line. HD4xxx indicates Tflex HD400 product line with thickness in mils (0.001) EXAMPLES: Tflex HD440 = 0.040 thick Tflex HD400 material Tflex HD4100DC1 = 0.10 thick Tflex HD400 material with DC1 option A17434-00 Tflex HD400 DS 070717 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
Laird / LS Research
Laird Connectivity
Laird Technologies EMI
Laird Technologies IAS
Laird Technologies Wireless M2M
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