CM20-NA-314 Laird Connectivity

THERMAL Warth Thermal Graphite Pad CM20 Material Thermal Impedance Volume Resistivity Temperature Range CM20 C/W (Area:T03) Wcm Property Compressed 0.07 0.002 -200 to +500C Graphite Test Method ASTM D5470 ASTM D991 (Mod) Description CM20 is a dry alternative to thermal compound. Its composition is 98% graphite and by nature offers both thermal and electrical conductivity. Low thermal resistance means that CM20 can be used in high power applications where maximum heat transfer is essential. High electrical conductivity is a natural property because of the graphite structure. CM20 provides a consistent low resistance path between transistor and heatsink. Contamination is eliminated because CM20 does not outgas or migrate like thermal compounds. It does not shrink or dry out. Ordering Information Key Performance Properties Standard sheet sizes are 300mm x Extremely low thermal resistance. 300mm each. Fills air gaps between components up to 7% of the pads thickness. Adhesive backed Remains resistant to cleaning agents, and does not support organic growth. CM20-AC-30x30 Non Adhesive No known deterioration over time. CM20-NA-30x30 Easily cut at room temperature into most configurations using steel rule dies or sharp blades. An extensive range of pre-cut Low tooling costs for custom profiles. profiles is also available, see additional datasheet for details. Electrically conductive. Technical Information Property Test Standard Thickness (mm) 0.200 0.02 -1 -1 Thermal Conductivity Wm K 3.85 MIL-I-49456A 2 Thermal resistance per cm 0.45C/W Hardness 84 5 Shore Micro Tear Resistance kN/m 8 ASTM D624 Tensile Strength MPa 3.6 ASTM D412 Dielectric Constant 1000Hz N/A ASTM D150 Elongation % 1 ASTM D412 Colour Dark grey Page 1 of 1 : Issue 08/01 Warth Kool Pad Pad Profiles THERMAL