86749 Nickel/Copper
Fabric Tape
Innovative Innovative TTechnologyechnology
for a for a Connected Connected WorldWorld
NI/CU POLYESTER CONDUCTIVE FABRIC TAPE
Laird Technologies Conductive Fabric Tape 86749 offers exceptional conformability and
conductivity for dynamic flex applications. It is constructed of nickel/copper metallized fabric with
a conductive pressure sensitive adhesive (PSA). This reliable tape design provides outstanding
shielding performance while offering superior abrasion and corrosion resistance under high
dynamic flex conditions. The 86749 is a halogen free product and can be supplied in tape or
further customized to application by die-cutting or hole punching.
FEATURES MARKETS
RoHS compliant Cabinet applications
Halogen-free per IEC-61249-2-21 standard LCD and Plasma TV
Low surface resistivity of < 0.06 / Medical equipment
provides excellent conductivity
Servers
Shielding effectiveness of >62 dB across
Printers
a wide spectrum of frequencies
Laptop computers
global solutions: local support
TM
USA: +1.866.928.8181
Europe: +49.0.8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com86749 Nickel/Copper
Fabric Tape
Innovative Technology
for a Connected World
Item Unit Value Test Method
Thickness mm 0.060 mm 0.01 -
>
Peel Adhesion Kgf / 25 mm 0.8 PSTC 101*
Shear Adhesion
#
at R.T. Hrs >72 PSTC 107
#
at 80C Hrs >5 PSTC 107
>
Tensile Strength Kgf / 25 mm 7
Operation Temperature C 0-80
<
Surface Resistivity (Fabric Side) / 0.06 ASTM F390
Z-axial Resistance <0.04
+
Shielding Effectiveness ASTM D4935
at 100 MHz dB 62
at 1GHz dB 68
Package Dimensions M W: Dimension by Customer Spec
(Max. Width: 1000 mm) L: Standard Length of 20 M
Shelf Life (Under 23C/65% R.H.) Six Months
*:Test Method A, dwell time 30 min. #:Contact area 25 mm by 25 mm +:Typical value
COMPOSITION OF PRODUCT
Conductive layer (metallized fabric)
Adhesive layer (acrylic conductive pressure sensitive adhesive)
Release paper
APPLICATION TECHNIQUES
1. Bond strength is dependent upon the amount of adhesive-to-surface contact developed.
Firm application pressure develops better adhesive contact & thus improves bond strength.
2. To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified.
A typical surface cleaning solvent is isopropyl alcohol. Use proper safety precautions for
handling solvents.
3. Ideal tape application temperature range is 21C to 38C. Initial tape application to surfaces
at temperatures below 10C is not recommended because the adhesive becomes too firm to
adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
EMI-DS-FOF-86749 1112
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of
Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for
any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and
Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies
Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein
provides a license under any Laird Technologies or any third party intellectual property rights.