TM
Tputty 502 Series
Innovative Technology
for a Connected World
Crea TeS CoMpreSSion of inTerfa Ce Ma Terial
Tputty 502 is the best material for applications where large tolerance
differences create the need for compression of the interface material beyond
50% of its original thickness.
Tputty 502 will flow and ensure low pressures on the components being
cooled. In conjunction with outstanding compression characteristics, Tputty 502
has a high thermal conductivity, resulting in very low thermal resistance.
Tputty 502 is naturally tacky and requires no additional adhesive coating that
can inhibit thermal performance.
fea TUreS anD BenefiTS appliCa TionS
Soft and ultra high compressibility for Cooling components to the
low stress applications chassis or frame
3 W/mK thermal conductivity Entire large panel PCB cooling
Available in sheets 0.020 - 0.200 Semiconductor automated test
(0.5mm - (5.0mm) thick and in bulk equipment (ATE)
Naturally tacky needing no further Any high compression low
adhesive coating stress application
global solutions: local support
TM
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermalTM
Tputty 502 Series
Innovative Technology
for a Connected World
Tputty 0.020 Tputty 0.040 Tputty 0.060 Tputty 0.080 Tputty 0.100 TEST METHOD
Construction & Reinforced boron nitride Reinforced boron nitride Reinforced boron nitride Reinforced boron nitride Reinforced boron nitride
Composition filled silicone elastomer filled silicone elastomer filled silicone elastomer filled silicone elastomer filled silicone elastomer
Color White White White White White Visual
Thickness 0.020 (0.51mm) 0.040 (1.02mm) 0.060 (1.52mm) 0.080 (2.03mm) 0.100 (2.54mm)
Thickness Tolerance 0.002 ( 0.05mm) 0.003 ( 0.08mm) 0.004 ( 0.10mm) 0.004 ( 0.10mm) 0.005 ( 0.13mm)
Specific Gravity 1.39 g/cc 1.38 g/cc 1.37 g/cc 1.37 g/cc 1.36 g/cc Helium
Pycnometer
Hardness *without 05 Shore OO 05 Shore OO 05 Shore OO 05 Shore OO 05 Shore OO ASTM D2240
fiberglass
Outgassing TML 0.11% 0.11% 0.11% 0.11% 0.11% ASTM E595
(Post Cured)
Outgassing CVCM 0.06% 0.06% 0.06% 0.06% 0.06% ASTM E595
(Post Cured)
Temperature Range -45C to 200C -45C to 200C -45C to 200C -45C to 200C -45C to 200C
Thermal 3 W/mK 3 W/mK 3 W/mK 3 W/mK 3 W/mK ASTM D5470
Conductivity (modified)
2 2 2 2 2
Thermal Impedance 0.44 C-in /W 2.84 0.49 C-in /W 3.16 0.53 C-in /W 3.42 0.58 C-in /W 3.74 0.62 C-in /W 4.00 ASTM D5470
2 2 2 2 2
@ 10 psi @ 69KPa C-cm /W C-cm /W C-cm /W C-cm /W C-cm /W (modified)
Thermal Expansion 92 ppm/C 92 ppm/C 92 ppm/C 92 ppm/C 92 ppm/C IPC-TM-650
2.4.24
Breakdown Voltage 2000 Volts AC 4000 Volts AC >5000 Volts AC >5000 Volts AC >5000 Volts AC ASTM D149
13 13 13 13 13
Volume Resistivity 5 x 10 ohm-cm 5 x 10 ohm-cm 5 x 10 ohm-cm 5 x 10 ohm-cm 5 x 10 ohm-cm ASTM D257
Dielectric Constant 3.20 3.20 3.20 3.20 3.20 ASTM D150
@ 1MHz
STDan arD ThiCkneSSeS
STDan arD SheeT SizeS
9 x 9 (229mm x 229mm) and 18 x 18 (457mm x 457mm).
0.020 (0.51mm) 0.030 (0.76mm) 0.040 (1.02mm) 0.050 (1.27mm)
9 x 9 only over 0.100 thickness
0.060 (1.52mm) 0.070 (1.78mm) 0.080 (2.03mm) 0.090 (2.29mm)
0.100 (2.54mm) 0.110 (2.79mm) 0.120 (3.05mm) 0.130 (3.30mm)
Tputty 502 is available in individual die cut shapes. Pressure sensitive adhesive is not
0.140 (3.56mm) 0.150 (3.81mm) 0.160 (4.06mm) 0.170 (4.32mm)
applicable for Tputty products.
0.180 (4.57mm) 0.190 (4.83mm) 0.200 (5.08mm)
Consult the factory for alternate thicknesses. reinforCeMenT
Tputty 502 sheets are reinforced on both sides with fiberglass.
BUlk Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
Tputty 502 is available in bulk form in the following sizes:
100 cc Jar 500 cc Jar 1000 cc Jar
Consult the factory for alternate bulk sizes.
THR-SPEC-Tputty-502 0710
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and ap-
plication of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness,
merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All
Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2010 Laird
Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
A13502-00 Rev G, 2/05/07