A17682-040 Laird Performance Materials

Tflex UT20000 Series Ultra-Thin Thermal Gap Filler Product Description Tflex UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed for thin interfaces that offers excellent thermal performance and high compliancy. It is designed without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy material handling and durability during assembly. Tflex UT20000 provides excellent interfacing and its ability to wet out mating surfaces allows for efficient transfer of heat away from components. It is an ideal choice for low-pressure applications and optimum solution in handheld devices with thin interface gap and limited space requirements. Tflex UT20000 is electrically non-conductive, stable from -50C thru 200C and offered in thicknesses that range from 0.008 (200 m) up to 0.040 (1000 m). FEATURES AND BENEFITS Thermal Conductivity of 3.0 W/mK No fiberglass carrier to minimize thermal resistance, yet still easy to handle Excellent surface wetting for low contact resistance Unique formulation minimizes thermal resistance at low mounting forces Environmentally friendly solution that meets regulatory requirements including RoHS and REACH SPECIFICATIONS TYPICAL PROPERTIES VALUE TEST METHOD Construction & Composition Ceramic filled silicone sheet N/A Color Grey Visual Thickness Range 200 m (0.008)- 1000 m (0.040) N/A Thermal Conductivity (W/mK) 3.0 Hot Disk Density (g/cc) 3.2 Helium Pyncometer Hardness (Shore 00) 83.3 (200-375) m ASTM D2240 56.4 (400-1000) m Outgassing TML (weight %) 0.34% ASTM E595 Outgassing CVCM (weight %) 0.09% ASTM E595 Temperature Range -50C to 200C Laird Test Method 0 Rth 200 m, 10 psi, 50 C 0.25Cin2/W ASTM D5470 Dielectric Constant 1MHz 5.87 ASTM D150 UL Flammability Rating V-0 UL 94 15 Volume Resistivity 2.2 x 10 ohm-cm ASTM D257 Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.comTflex UT20000 Series Ultra-Thin Thermal Gap Filler Tflex UT20000 Thermal Resistance vs Pressure 0.600 C-in2/W 0.500 C-in2/W 0.400 C-in2/W 0.300 C-in2/W 0.200 C-in2/W 0.100 C-in2/W 0.000 C-in2/W 10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi 8mils 10mils 16mils 20mils 30mils 40mils AVAILABILITY STANDARD THICKNESSES 0.008 (200 m) up to 0.020 (500 m) thick material available in 25 m increments Also available in 0.025 ( 625um), 0.030 (750 um), 0.035 (875um) , 0.040 (1000 um) Available in standard sheet sizes of 18 x 18 and 9 x 9 or custom die cut parts. Custom die cut parts on a roll available for 200 m (0.008) thru 375 m (0.015) PART NUMBER SYSTEM Tflex indicates Laird elastomeric thermal gap filler product line. UT20000 indicates Tflex UT20000 product line with thickness in microns T f l e x UT2 0 5 0 0 m 0250 => 250m Product code Pad thickness 0325 => 325m 0500 => 500m 1000 => 1000m EXAMPLES: Tflex UT20200= 200 m (0.008) thick Tflex UT20000 material Tflex UT20500= 500 m (0.020) thick Tflex UT20000 material A17759-00 Tflex UT20000 DS 051419 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.