Tflex B200 Thermal Gap Filler PRODUCT DESCRIPTION Tflex B200 is a reliable, compliant thermal interface material offering good thermal performance and easier handling and features a range of multiple surface and enforcement options for a variety of applications. This gap fillers low modulus interface and softness relieves mechanical stress. It properly fills gaps, with tolerance to reduce thermal resistance. Tflex B200 helps absorb shock, resulting in improved device reliability over the long term. It has high dielectric insulation which works to protect against dielectric breakdown in or between devices. Tflex B200 as a standard product is naturally tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and transport. Tflex B200MFG, an option featuring fiberglass in the middle, has strong tensile and both sides exhibit tackiness properties. This helps prevent deforming during manual or automated assembly. Tflex B200FG, a second option, has fiberglass enforcement located near one side. It offers a side difference, a higher deflection than the B200MFG option, and provides protection close to one side. FEATURES AND BENEFITS Thermal Conductivity of 2W/m.K Compliant to application surfaces, long term reliability Shock resistance in automotive applications Fiberglass enforcement, protection against breakthrough or deforming Protection with high DBV SPECIFICATIONS TYPICAL PROPERTIES VALUE TEST METHOD Construction & Composition Ceramic filled silicone sheet Color Grey Visual Thickness 1mm~5mm(MFG, Standard) 0.5mm~5mm(FG) Thickness Tolerance +/- 10% Thermal Conductivity (W/mK) 2 ASTM D5470 Density (g/cc) 2.2 Helium Pycnometer Hardness (Shore 00) 42 ASTM D2240 Outgassing TML (weight %) 0.32 ASTM E595 Temperature Range -40C to 150C Laird Reliability Test Americas: +1 (866) 928-8181 Rth 40 mils, 10 psi 1.10 Cin2/W ASTM D5470 (Modified) Europe: +49 8031 2460 0 UL Flammability Rating V-0 UL 94 China: +86-7552 7141166 13 Volume Resistivity 2 x 10 ohm-cm ASTM D257 pm.lairdtech.com Tflex B200 Thermal Gap Filler %Deflection VS Pressure 60.0 40.0 20.0 0.0 5psi 10psi 20psi 30psi 40psi 50psi 60psi 70psi 80psi 90psi 100psi Tflex B240 Tflex B260 Tflex B280 Tflex B2100 Tflex B2120 Tflex B2140 Tflex B2160 Tflex B2180 Tflex B2200 Tflex B200 Thermal resistance VS Pressure 3.500 3.000 2.500 2.000 1.500 1.000 0.500 0.000 10 PSI 20 PSI 30 PSI 40 PSI 50 PSI 60 PSI 70 PSI 80 PSI 90 PSI 100 PSI Tflex B220FG Tflex B240 Tflex B260 Tflex B280 Tflex B2100 Tflex B2120 Tflex B2140 Tflex B2160 Tflex B2180 Tflex B2200 AVAILABILITY STANDARD THICKNESSES Standard B200, MFG options, 1.0 mm (0.040) to 5.0 mm (0.200) thick material available in 0.25mm (0.010) increments B200FG option, 0.5 mm (0.020) to 5.0 mm (0.200) thick material available in 0.25mm (0.010) increments Available in standard sheet sizes of 18 x 18 , and custom die cut part PART NUMBER SYSTEM Tflex indicates Laird elastomeric thermal gap filler product line. B2xxx indicates Tflex B200 product line with thickness in mils EXAMPLES: Tflex B240 = 1000 microns / 0.040 thick material Tflex B200 DS 190506 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.