Precision Metals NIC 3.0 Fingerstock and Custom Clip Opportunities Laird leads the industry in Fingerstock and Custom Metal Clip design expertise and technologies. This is widely recognized in the marketplace and one of the reasons why Laird was chosen as a supplier for precision metal components in the Open Compute Project (OCP) NIC 3.0. The Open Compute Project (OCP) is a collaborative community focused on redesigning hardware technology to efficiently support the growing demands on compute infrastructure. Community partners include: Facebook, HP, Intel, AMD, Broadcom, Google, Huawei, Microsoft, LinkedIn, AT&T, Verizon, Nokia, etc. One specific project that is being worked on by OCP is called NIC 3.0. NIC 3.0 specification defines a third- generation mechanical form factor that allows for interoperability between compliant baseboards and OCP NIC 3.0 cards. In addition, NIC 3.0 is addressing the limitations currently being experienced with NIC 2.0 such as board space, mechanical profile, connector placement, and specification quality. Two different form factor modules will be included in NIC 3.0, a small form factor (SFF) and a large form factor (LFF) see Figures 1 and 2 for 4X SFP version examples. For additional NIC 3.0 information click this link: HTTPS://WWW.OPENCOMPUTE.ORG/WIKI/SERVER/MEZZ Figure 1 NIC 3.0 SFF Module (4X SFP version) Figure 2 NIC 3.0 LFF Module (4X SFP version) The modules will include both fingerstock and side spring parts (Figure 3) and then the modules will get inserted into a chassis (Figure 4). Laird has worked with the OCP community to have Lairds part numbers stated in the NIC 3.0 specification so the large number of companies that will adopt to this specification can place orders directly with Laird for the parts. The parts are in inventory at all the regional sampling centers for quick 24-hour turn on prototypes. Table 1 states the Laird part numbers by each module form factor type. In addition, hard tooling is already in place in Shenzhen to support larger quantity orders. Figure 3 - Example of a 2X QSFP version module showing the location of the fingerstock and side springs. Precision Metals NIC 3.0 Fingerstock and Custom Clip Opportunities Figure 4 NIC 3.0 module including chassis example (1) Laird Part Description Module Form Factor Qty Per Number LT18CJ4430 Be/Cu Fingerstock 9 fingers SFF w/ Ejector Latch 1 LT18CJ1920 Be/Cu Fingerstock 11 fingers SFF w/ Internal Lock or Pull Tab 1 LT18CJ1921 Be/Cu Fingerstock 13 fingers SFF w/ Ejector Latch, Internal Lock, or 1 Pull Tab LT18DP1911 Be/Cu Side Clips SFF w/ Ejector Latch, Internal Lock, or 2 Pull Tab LT18CJ1922 Be/Cu Fingerstock 25 fingers LFF w/ Ejector Latch 1 LT18CJ1923 Be/Cu Fingerstock 27 fingers LFF w/ Ejector Latch 1 LT18DP1911 Be/Cu Side Clips LFF w/ Ejector Latch 2 Table 1 Part Number List (1): If Be-Free is a requirement, alternative materials such as Recyclable Clean Copper (RCC) are available for testing and evaluation. USA: +1.866.928.8181 Europe: +49.8031.24600 Asia: +86.755.2714.1166 www.lairdtech.com Precision Metals NIC 3.0 122418 2 Any information furnished by Laird Limited, its subsidiary companies and its agents (hereafter, Laird) is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials rests with the end user, since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to the fitness, merchantability or suitability of any Laird materials or products for any specific or general uses. Laird disclaims liability for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of sale in effect at the time of sale. A current copy of the Laird Terms and Conditions will be furnished upon request. This document is Copyright 2018, Laird, all rights reserved. Laird, Laird Technologies, the Laird Logo, and other marks are trademarks of Laird. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird or any third party intellectual property rights.