Thermal Gap Fillers Product Profile The Leading Edge in EMI Shielding Technology Applications - LED Lighting - Micro Processors - Integrated Circuits - Mobile Electronics Thermal Gap Fillers TGF10-TGF25 - Power Conversions - Heat Sink Interface Thermal gap fillers are a reliable heat transfer media which conform to surface gaps and irregularities to fill the air gaps and conduct heat from a heat source to another surface, or heat sink. Where space exists between two mating surfaces varies, whether from different shapes or rough surface textures, a thermal transfer concern is often present. Available in a wide variety of shapes, sizes, and thermal conductivities, Benefits thermal gap fillers are a cost-effective solution for some of the most difficult and delicate thermal situations in a broad range of applications. - Low Cost - Short Lead Times Thermal Properties TGF10 TGF10S TGF15 TGF20 TGF20SF TGF25 Test Method - Custom Shapes Thermal 1.0 0.2 1.0 0.2 1.5 0.2 2.0 0.2 2.0 0.2 2.5 0.2 ASTM D5470 - Self Tacking Conductivity, W/mK Thermal 2.0 max 3.0 max 1.5 max 1.2 max 0.7 max 1.0 max ASTM D5470 - Increased Reliability 2 Resistance, Cin /W - Wide Range of Physical Properties Thermal Conductivity Color White Grey White Pink Light Blue White Grey Yellow Visual - UL 94 V-0 Rated 0.008 - 0.551 0.020 - 0.118 0.008 - 0.551 0.012 - 0.551 0.020 - 0.118 0.012 - 0.551 ASTM D374 Thickness, in (mm) (0.2 - 14.0) (0.5 - 3.0) (0.2 - 14.0) (0.3 - 14.0) (0.5 - 3.0) (0.3 - 14.0) 0.085 0.018 0.085 0.018 0.094 0.018 0.101 0.018 0.098 0.018 0.105 0.018 ASTM D792 3 Density, lb/in (g/cc) Material (2.35 0.5) (2.35 0.5) (2.62 0.5) (2.8 0.5) (2.7 0.5) (2.93 0.5) 8 - 60 5 -15 10 - 55 10 - 55 30 - 40 10 - 55 ASTM D2240 Hardness, Shore C - Aluminum Oxide Filled Silicone Compression 25 min 40 min 25 min 25 min 25 min 20 min ASTM D575 Ratio, % 50 psi - Non Silicone (Acrylic Based) Available Tensile Strength, MPa 0.3 min 1.50 min 0.25 min 0.25 min 0.15 min 0.20 min ASTM D412 Elongation, % 80 min 5 min 80 min 70 min 80 min 70 min ASTM D412 - Boron Nitride Filled Silicone Operating -58 - 392 -40 - 302 -58 - 392 -58 - 392 -40 - 302 -58 - 392 Temperature, F (C) (-50 - 200) (-40 - 150) (-50 - 200) (-50 - 200) (-40 - 150) (-50 - 200) Electrical Properties 8 8 8 8 8 8 Volume 1.0x10 min 1.0x10 min 1.0x10 min 1.0x10 min 1.0x10 min 1.0x10 min ASTM D257 Resistivity, cm Breakdown 8 min 8 min 8 min 8 min 8 min 8 min ASTM D149 Voltage, kV Dielectric 2 min 2 min 2 min 2 min 2 min 2 min ASTM D150 Constant 1 MHz Dielectric Loss 0.1 max 0.1 max 0.1 max 0.1 max 0.1 max 0.1 max ASTM D150 Regulatory Flammability Rating V-0, 5V V-0, 5V V-0, 5V V-0, 5V V-0, 5V V-0, 5V UL94 TGFEA RoHS Compliant Yes Yes Yes Yes Yes Yes Shelf Life, months 24 24 24 24 24 24 Thermal Gap Filler www.LeaderTechInc.com Global EMI Shielding Technology Center 12420 Race Track Rd., Tampa, Florida 33626 866.TECH.EMI (866.832.4364) t 813.855.6921 f 813.855.3291 STATEMENT OF LIEU OF WARRANTY: All technical information and data in this document is based on tests and is believed to be accurate and reliable. Nevertheless, since the products described herein are not provided to conform with mutually accepted specifications and the use thereof is unknown, the manufacturer and seller of the products do not guarantee results, freedom from patent infringement, or suitability of the products for any application thereof. The manufacturer and seller of the products described in this document will provide all possible technical assistance and will replace any products proven defective. No statement or recommendations made by the manufacturer or seller not contained herein shall have any force of effect unless in conformity with an agreement signed by an officer of the seller and manufacturer. Product testing by the Copyright Leader Tech, Inc. 2015 purchaser is recommended in order to confirm expected results. Thermal Gap Fillers Product Profile The Leading Edge in EMI Shielding Technology Applications - LED Lighting - Micro Processors - Integrated Circuits - Mobile Electronics - Power Conversions - Heat Sink Interface Thermal Gap Fillers TGF30-TGF60 Thermal gap fillers are a reliable heat transfer media which conform to surface gaps and irregularities to fill the air gaps and conduct heat from a heat source to another surface, or heat sink. Where space exists Benefits between two mating surfaces varies, whether from different shapes or rough surface textures, a thermal transfer concern is often present. Available in a wide variety of shapes, sizes, and thermal conductivities, thermal gap fillers are a cost-effective solution for some of the most difficult and delicate thermal situations in - Low Cost a broad range of applications. - Short Lead Times - Custom Shapes Thermal Properties TGF30 TGF30BN TGF30SF TGF35 TGF40 TGF50 TGF60 Test Method - Self Tacking Thermal 3.0 0.25 3.0 0.5 3.0 0.25 3.5 0.25 4.0 0.25 5.0 0.5 6.0 0.5 ASTM D5470 - Increased Reliability Conductivity, W/mK - Wide Range of Thermal 0.9 max 1.2 max 0.6 max 0.8 max 0.75 max 0.7 max 0.5 max ASTM D5470 2 Thermal Conductivity Resistance, Cin /W Physical Properties - UL 94 V-0 Rated Color Sky Blue White White Grey Green Purple White Gray Visual 0.012 - 0.551 0.020 - 0.157 0.020 - 0.118 0.020 - 0.157 0.020 - 0.157 0.020 - 0.118 0.020 - 0.118 ASTM D374 Thickness, in (mm) Material (0.3 - 14.0) (0.5 - 4.0) (0.5 - 3.0) (0.5 - 4.0) (0.5 - 4.0) (0.5 - 3.0) (0.5 - 3.0) 0.107 0.018 0.054 0.018 0.105 0.018 0.110 0.018 0.112 0.018 0.112 0.018 0.116 0.018 ASTM D792 3 Density, lb/in (g/cc) - Aluminum Oxide (2.95 0.5) (1.5 0.5) (2.9 0.5) (3.05 0.5) (3.12 0.5) (3.2 0.5) (3.2 0.5) Filled Silicone 15 - 55 35 - 45 30 - 40 30 - 60 30 - 55 35 - 50 35 - 45 ASTM D2240 Hardness, Shore C - Non Silicone (Acrylic Compression 20 min 20 min 25 min 15 min 15 min 15 min 15 min ASTM D575 Based) Available Ratio, % 50 psi - Boron Nitride Filled Silicone Tensile Strength, MPa 0.15 min 0.15 min 0.15 min 0.15 min 0.15 min 0.15 min 0.15 min ASTM D412 Elongation, % 60 min - 80 min 60 min 60 min 60 min 50 min ASTM D412 Operating -58 - 392 -58 - 320 -40 - 302 -58 - 356 -58 - 356 -58 - 356 -58 - 356 Temperature, F (C) (-50 - 200) (-50 - 160) (-40 - 150) (-50 - 180) (-50 - 180) (-50 - 180) (-50 - 180) Electrical Properties 8 10 8 8 8 8 8 Volume 1.0x10 min 1.0x10 min 1.0x10 min 1.0x10 min 1.0x10 min 1.0x10 min 1.0x10 min ASTM D257 Resistivity, cm Breakdown 8 min 10 min 8 min 8 min 8 min 7 min 3 min ASTM D149 Voltage, kV Dielectric 2 min 3.5 min 2 min 2 min 2 min 2 min 5 min ASTM D150 Constant 1 MHz Dielectric Loss 0.1 max 0.002 max 0.1 max 0.1 max 0.1 max 0.1 max 0.1 max ASTM D150 TGFEA Regulatory Flammability Rating V-0, 5V V-0, 5V V-0, 5V V-0, 5V V-0, 5V V-0, 5V V-0, 5V UL94 Thermal Gap Filler RoHS Compliant Yes Yes Yes Yes Yes Yes Yes Shelf Life, months 24 24 24 24 24 24 24 www.LeaderTechInc.com Global EMI Shielding Technology Center 12420 Race Track Rd., Tampa, Florida 33626 866.TECH.EMI (866.832.4364) t 813.855.6921 f 813.855.3291 STATEMENT OF LIEU OF WARRANTY: All technical information and data in this document is based on tests and is believed to be accurate and reliable. Nevertheless, since the products described herein are not provided to conform with mutually accepted specifications and the use thereof is unknown, the manufacturer and seller of the products do not guarantee results, freedom from patent infringement, or suitability of the products for any application thereof. The manufacturer and seller of the products described in this document will provide all possible technical assistance and will replace any products proven defective. No statement or recommendations made by the manufacturer or seller not contained herein shall have any force of effect unless in conformity with an agreement signed by an officer of the seller and manufacturer. Product testing by the Copyright Leader Tech, Inc. 2015 purchaser is recommended in order to confirm expected results.