EYG.1B.308.CLN www.lemo.com SUMMARY Wires Low voltage 8 Image is for illustrative purpose only Series 1B Download Female print PCB Termination type Request a quote IP rating 50 PCB Eagle Pattern AWG wire size 30.00 - 22.00 PCB Altium Pattern Cable 0.00 - 0.00 mm PCB KiCad Pattern Status active Catalog Matching parts FGG.1B.308.CLAD52Z TECHNICAL DETAILS Mechanics Shell Style/Model EY*: Fixed receptacle for printed circuit, nut fixing (back panel mounting) Keying 1 key (alpha=0, plug: male contacts, receptacle: female contacts) Brass (chrome plated SAE AMS 2460 ) shell and collet nut, nickel plated SAE AMS QQ N 290 Housing Material brass latch sleeve and mid pieces Weight 12.66 g Performance Configuration 1B.308 : 8 Low Voltage Insulator L: PEEK (UL 94 / V-0/1.5) Rated Current 5 Amps Specifications Contact Type: Print (straight) Contact Dia.: 0.7 mm (0.028in) R (max): 6.1 mOhm Vtest (contact-shell): 1150 V (AC), 1630 V (DC) Vtest (contact-contact): 950 V (AC), 1340 V (DC) Others LEMO products and services are provided as is. LEMO makes no warranties or representations with regard to LEMO product & services or use of them, express, implied or statutory, including for accuracy, completeness, or security. The user is fully responsible for his products and applications using LEMO components. 1/3Endurance (Shell): 5000 Temp (min / max): -55C / +250C Humidity (max): <=95% at 60 deg C /140 F Vibration: 15 g 10 Hz - 2000 Hz Shock Resistance: 100 g 6 ms Climatical Category: 50/175/21 Shielding (min): 75 dB (10 MHz) Shielding (min): 40 dB (1 GHz) Salt Spray Corrosion: >1000 hr 12NC part number: 4022.438.33321 DRAWINGS Dimensions A B C D E M N P e mm. 14 12 16 7.62 5 3.5 19 10 M11x0.5 in. 0,55 0,47 0,63 0,30 0,20 0,14 0,75 0,39 RECOMMENDED BY LEMO Tools LEMO products and services are provided as is. LEMO makes no warranties or representations with regard to LEMO product & services or use of them, express, implied or statutory, including for accuracy, completeness, or security. The user is fully responsible for his products and applications using LEMO components. 2/3