LTL1CHTBK3-SS Lite-On

LITE-ON TECHNOLOGY CORPORATION P r o p e r t y o f L i t e - O n O n l y Features * Low power consumption. * High efficiency. * Versatile mounting on p.c. board or panel. * I.C. compatible/low current requirement. * 3.1 mm diameter package. Package Dimensions Part No. Lens Source Color LTL1CHTBK3 Water Clear InGaN Blue Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25mm(.010 ) unless otherwise noted. 3. Protruded resin under flange is 1.0mm(.04 ) max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice. Part No. : LTL1CHTBK3 Page : 1 of 10 BNS-OD-C131/A4 LITE-ON TECHNOLOGY CORPORATION P r o p e r t y o f L i t e - O n O n l y Absolute Maximum Ratings at TA=25 Parameter Maximum Rating Unit Power Dissipation 120 mW Peak Forward Current 100 mA (1/10 Duty Cycle, 0.1ms Pulse Width) DC Forward Current 30 mA Operating Temperature Range -25C to + 80C Storage Temperature Range -30C to + 100C Lead Soldering Temperature 260C for 5 Seconds 1.6mm(.063 ) From Body Part No. : LTL1CHTBK3 Page : 2 of 10 BNS-OD-C131/A4