POLYSWITCH Resettable PTCs Surface Mount > LoRho Series LoRho SMD PTC for Charging Cable Protection Description The Littelfuse LoRho SMD PTC for Charging Cables provides protection from heat generated due to faults within the connector such as USB-C, microUSB, and many others. As connectors get smaller, their pin-to-pin spacings are shrinking which increases the opportunity for debris such as dust, dirt, or water to collect causing a fault. These faults can generate heat which may damage charging cables, the devices they charge, or the people using them. Agency Approvals Features AGENCY AGENCY FILE NUMBER AMPERE RANGE SMD compatible with Ultra lo w internal reflow soldering process resistance E74889* 4.5A A vailable in small 1206 R eset automatically J 50313999* 4.5A and 1210 sizes Halogen-free, lead-free * See Electrical Characteristic Table for approved part numbers. Up to 21Vdc and and RoHS compliant 4.5A I hold Applications Benefits O ver temperature (OT) F ast charging standards protection for USB and protocols including: Surface mount design W ell-suited for fast- connectors and cables USB Power Delivery (PD) reduces assembly time charging applications up including: and cost compared to to 21Vdc and 4.5A I Qualcomm Quick hold USB Type-C leaded/strapped models Charge (QC) USB Micro-B Sa ves PCB space in the Mediatek Pump USB-C connector and Express (PE) USB-A ensures that the USB-C Samsung Adaptive plug meets USB-IF Fast Charging (AFC) dimension specifications Huawei/HiSilicon Fast Charging Protocol (FCP) These charging protocols are the property of their respective owners. Electrical Characteristics Thermal Cut Off Thermal Cut Off Agency Resistance 1 2 3 (TCO) - C 2A (TCO) - C 3A Approvals I V P typ. hold max d Part Number Marking (A) (Vdc) (W) 4 5 R R min 1max Min Max Min Max () () nanoSMD350LR-C P 3.50 12 75 100 60 85 1.0 0.004 0.018 -- -- nanoSMD400LR-C S 4.00 12 85 110 70 95 1.0 0.004 0.010 -- -- microSMD450LR-C S 4.50 12 90 115 75 100 1.0 0.002 0.0085 X X 400CC1206LR-C Y 4.00 21 85 110 70 95 1.0 0.004 0.010 -- -- 450CC1210LR-C K 4.50 21 90 115 75 100 1.3 0.002 0.008 -- -- Notes: TCO and Pd Testing Method: 1. I = Hold current: maximum current device will pass without tripping in 20C still air hold Thermal Cut-Off Test 2. V = Maximum voltage device can withstand without damage at rated current (I ) max max 1. Put the device into the thermostatic chamber controlled at room temperature or 25C. 3. P = Power dissipated from device when in the tripped state at 20C still air d 2. Apply the specified current to the device, and increase the chamber temperature at the 4. R = Minimum resistance of device in initial (un-soldered) state min rate of 2C per minute. 5. R = Maximum resistance of device at 20C measured one hour after tripping or 1max 3. Measure the device ambient temperature when the applied current has reduced to less reflow Soldering of 260C for 20 seconds than 20% of initial value. (Values specified were determined using PCBs with 0.115in x 1.0in ounce copper traces) Power Dissipation Caution: Operation beyond the specified rating may result in damage and possible arcing 1. Conduct thermal cut-off test at rated current/voltage. 2. After device trip, decrease the chamber temperature with keeping trip state. and flame 3. Measure the tripped-state power dissipation when the device ambient temperature has reduced to 30C or less. 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/15/19 POLYSWITCH Resettable PTCs Surface Mount > LoRho Series Temperature Rerating Ambient Operating Temperature -20C 0C 20C 60C 85C Part Number Hold Current (A) nanoSMD350LR-C 4.80 4.00 3.50 1.90 1.30 nanoSMD400LR-C 5.20 4.60 4.00 2.82 2.10 microSMD450LR-C 6.20 5.50 4.50 3.30 2.30 400CC1206LR-C 5.20 4.60 4.00 2.82 2.10 450CC1210LR-C 6.20 5.50 4.50 3.30 2.30 Note: The temperature rerating data is for reference only. Please contact Littelfuse technical support for detail temperature rerating information. Temperature Derating Curve Environmental Specifications Operating Temperature -20C to +85C Maximum Device Surface 125C Temperature in Tripped State +85C, 1000 hours Passive Aging -/+10% typical resistance change +85C, 85% R.H.,100 hours Humidity Aging -/+15% typical resistance change MILSTD202, Method 215 Thermal Shock No change MILSTD883, Method 2007, Vibration Condition A No change Moisture Sensitivity Level Level 2a, JSTD020 Physical Specifications Terminal Solder-Plated Copper Materials (Solder Material: Matte Tin (Sn)) Lead Meets EIA Specification RS186-9E, ANSI/J- Solderability STD-002, Category 3 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/15/19