PolySwitch Temperature Indicators Surface Mount > setP Series RoHS setP Temperature Indicators for USB Type-C Description The Littelfuse setP temperature indicator helps protect USB Type-C plugs from overheating. It has been designed to the unique specifications of USB Type-C and is capable of helping to protect even the highest levels of USB Power Delivery. Features Compact footprint: Easy part selection 0805 mils (2.0 x 1.2mm) USB Power Delivery Sensitive and reliable compliant Agency Approvals temperature indication Protects systems with SMD compatible with 100W or higher power Agency Agency File Number reflow soldering process Evaluated to UL 1434 and Zero IR loss contribution Annex J of IEC 60730-1 E74889 J 50313999 Applications USB Type-C Plugs Fast charging standards and protocols compliant Chargers with captive with USB-C and USB-PD Type-C Cables USB-C to USB-C Cable Temperature Indication Characteristics Indicating Temperature (C) Resistance () Part Number Marking Code 1 2 3 Min Typical Max Max at 25C R ind SETP0805-100-SE T 90 100 110 12 35,000 SETP0805-100-CC V 90 100 110 6 35,000 Notes: 1. T = Typical indicating temperature: Typical temperature when device switches to indicating resistance (R ) ind ind 2. Maximum post reflow resistance measured at 25C in still air 3. R = Indicating resistance when device reaches the indicating temperature (T ) ind ind 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/19 PolySwitch Temperature Indicators Surface Mount > setP Series Electrical Characteristics 1 2 3 4 Maximum Time-To-Trip Resistance I I V I hold trip max max 5 Part Number P typ. (W) d 6 7 (A) (A) (Vdc) (A) Current (A) Time (Sec.) R () R () min 1max SETP0805-100-SE 0.06 0.25 6 1 0.6 0.3 1 0.5 12 SETP0805-100-CC 0.075 0.30 6 1 0.6 0.3 5 0.5 6 Notes: 1. I = Hold current: maximum current device will pass without tripping in 20C still air hold 2. I = Trip current: minimum current at which the device will trip in 20C still air trip 3. V = Maximum voltage device can withstand without damage at rated current (I ) max max 4. I = Maximum fault current device can withstand without damage at rated voltage (V ) max max 5. P = Power dissipated from device when in the tripped state at 20C still air d 6. R = Minimum resistance of device in initial (un-soldered) state min 7. R = Maximum resistance of device at 20C measured one hour after tripping or reflow Soldering of 260C for 20 seconds 1max (Values specified were determined using PCBs with 0.115in x 1.0in ounce copper traces) Caution: Operation beyond the specified rating may result in damage and possible arcing and flame Resistance Vs. Temperature Curve Environmental Specifications Operating Temperature -40C to +85C 1.E+09 Maximum Device Surface 110C Temperature in Tripped State 1.E+08 SETP0805-100-SE +70C 1000 hours Passive Aging R after test 1max 1.E+07 +60C, 90% R.H., 1000 hours Humidity Aging SETP0805-100-CC R after test 1max 1.E+06 MILSTD202, Method 215 Thermal Shock No change -40C to +85C, 10 Cycles 1.E+05 MILSTD202, Method 215 Solvent Resistance No change 1.E+04 MILSTD883, Method 2007, Vibration Condition A No change 1.E+03 Moisture Sensitivity Level Level 2a, JSTD020 1.E+02 1.E+01 Physical Specifications 1.E+00 Solder-Plated Copper Terminal Material 20 40 60 80 100 120 140 (Solder Material: Matte Tin (Sn)) Meets EIA Specification RS186-9E, Temperature, C Lead Solderability ANSI/J-STD-002, Category 3. Soldering Parameters Profile Feature Pb-Free Assembly t P T P Average Ramp-Up Rate (T to T ) 3C/second max Critical Zone S(max) P t to t L P Ramp-uRamp-upp Temperature Min (T ) 150C s(min) T L t L Pre Heat: Temperature Max (T ) 200C s(max) T S(max) Ramp-dRamp-dowo n Time (Min to Max) (t ) 60 120 secs s PreheaPreheatt Temperature (T ) 217C Time Maintained L T S(min) Above: t Temperature (t ) 60 150 seconds S L +0/-5 Peak / Classification Temperature (T ) 260 C P 25 Time within 5C of actual peak Temperature time to peak temperature Time 30 seconds max (t ) p Ramp-down Rate 2C/second max -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the Time 25C to peak Temperature (T ) 8 minutes Max. P performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N environment for lead 2 -- Recommended maximum paste thickness is 0.25mm (0.010 inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/19 Resistance, () Temperature