POLYSWITCH Surface Mount > zeptoSMDC PPTC zeptoSMDC Series Description Littelfuse zeptoSMDC Series PPTC is developed for overcurrent and overtemperature protection in mobile applications. It works as a fail-safe to protect battery management ICs and fuel gauges. Features Maximum electrical Small footprint 0201 size rating: 13 VDC R oHS compliant Short circuit cur rent: ISO/TS 1 6949 certified 82~200mA Applications Smartphones and Tablets Mobile point of sale Benefits Notebook PC W earables R esets to normal Save space due to small e-R eaders Smart watches operation after fault is footprint Port able medical W ireless speakers cleared equipment P ortable game players Help protect bat tery monitor IC from electrical over-stress Electrical Characteristics Initial Resistance Post Process 5 Time to Trip Trip Hold 6 Ohms 25C Resistance 2 3 4 V I Temperature Current MAX MAX Part Number (Vdc) (mA) C (mA) Time ohms ohms Current 1 TYP 25C Min Max (ms) -20C 60C (mA) Max Min Max zeptoSMDC0011F 10 80 13 82 125 11 80 20 68 290 zeptoSMDC0015F 10 60 13 200 125 15 80 20 28 150 Notes: 1. R = Minimum resistance of device in initial (un-soldered) state min 2. V = Maximum voltage device can withstand without damage at rated current (I ) max max 3. I = Maximum fault current device can withstand without damage at rated voltage (V ) max max 4. I = Hold current: maximum current device will pass without tripping in 25C still air. Values specified using PCBs with 0.004 x 1.0 ounce copper traces hold 5. Time to trip values specified using PCBs with 0.004 x 1.0 ounce copper traces 6. With LOCTITE ECCOBOND UF 3915, curing condition: 140C/20mins, resistance is measured 12 hours post coating curing process 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/12/20 POLYSWITCH Surface Mount > zeptoSMDC Environmental Specifications Physical Specifications Operating Temperature -20C to 60C Solder-Plated Copper Terminal Materials (Solder Material: NiAu) +85C, 1000 hours Passive Aging -25% typical resistance change Meets EIA Specification RS186-9E, Lead Solderability ANSI/J- STD-002B, Test S +65C, 90% R.H.,100 hours Humidity Aging -/+15% typical resistance change MILSTD202, Method 107G Thermal Shock -33% typical resistance change -40C to +85C (20 Times) MILSTD202, Method 204, Vibration Condition A No change Moisture Sensitivity Level Level 2a, JSTD020 Soldering Parameters Profile Feature Pb-free assembly t P Average Ramp-Up Rate (Liquidus Temp (T ) 1~3C/second T L P to peak max. RRamp-uamp-upp Temperature Min. (Ts ) 130C T L min t L Preheat T S(max) Temperature Max. (Ts ) 180C max Ramp-dowRamp-do n Time Min. to Max. (Ts) 90-110 seconds PreheatPreheat T 2C/seconds max. S(min) Ts to T Ramp-up Rate max L t S 217C Temperature (T ) (Liquidus) L Reflow 25 Time (t ) 60~70 seconds L time to peak temperature Time Peak Temperature (T ) 240C P Time within 3C of actual Peak Temperature (t ) 35 seconds P All temperature refer to topside of the package, measured on the package body surface. If refl ow temperature exceeds the recommended profile, devices may not meet Ramp-Down Rate 2~4C/seconds the performance requirements. R ecommended reflow methods:IR, vapor phase oven, hot air oven. Time 25C to Peak Temperature (T ) 300 seconds max. P Customer should v alidate that the solder paste amount and reflow recommendations to meet its application Recommended maximum paste thickness is 0.25 mm (0.010 inch). De vices can be cleaned using standard industry methods and aqueous solvents. De vices can be reworked using the standard industry practices (avoid contact to the device). 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/12/20 Temperature