L1F2-5070100000000 Lumileds

ILLUMINATION LUXEON FlipChip White Chip-scale packages for maximum design flexibility LUXEON FlipChip White enables the next generation of lighting applications. Lumileds industry-leading line of Chip Scale Package (CSP) LEDs gives customers complete design flexibility. LUXEON FlipChip White includes the highest flux-density chip scale package, maximizing beam control and enabling high packing density on a PCB. Its wide viewing angle delivers increased uniformity and potential for system cost reductions in diffuse and omnidirectional lighting applications. In addition, LUXEON FlipChip White is the ideal choice for cost sensitive applications as it can achieve high efficacy and flux at high current density, providing leading lm/ . FEATURES AND BENEFITS PRIMARY APPLICATIONS Direct attach no wire bonds for high reliability Downlights Micro sized: 1.4mm x 1.4mm and 1.1mm x 1.1mm packages for High Bay & Low Bay design flexibilty and high packing density Small source size for highest luminance and beam control Lamps Wide viewing angle provides increased uniformity Outdoor High efficacy at high drive current provides leading system level lm/ Specialty Lighting Low thermal resistance down to 2C/W for LUXEON FlipChip White 10 Spotlights DS117 LUXEON FlipChip White Product Datasheet 2015 Lumileds Holding B.V. All rights reserved.Table of Contents General Product Information 2 Product Test Conditions...................... 2 Part Number Nomenclature .................... 2 Lumen Maintenance ....................... 2 Environmental Compliance ..................... 2 Performance Characteristics 3 Product Selection Guide...................... 3 Optical Characteristics ....................... 3 Electrical and Thermal Characteristics.................... 3 Absolute Maximum Ratings . 4 Characteristic Curves . 5 Spectral Power Distribution Characteristics ................. 5 Light Output Characteristics .................... 6 Forward Current Characteristics..................... 7 Radiation Pattern Characteristics .................... 8 Product Bin and Labeling Definitions 10 Decoding Product Bin Labeling..................... 10 Luminous Flux Bins ....................... 11 Color Bin Definition ....................... 12 Forward Voltage Bins ..................... 13 Mechanical Dimensions 13 Reflow Soldering Guidelines 15 JEDEC Moisture Sensitivity ....................... 15 Solder Pad Design ........................ 16 Packaging Information . 17 Bin Sheet .......................... 17 Tape and Reel Dimensions..................... 18 DS117 LUXEON FlipChip White Product Datasheet 20151123 2015 Lumileds Holding B.V. All rights reserved. i