LXHL-PB01 Lumileds

LUXEON Rebel and * LUXEON Rebel ES Assembly and Handling Information Application Brief AB32 LUXEON Rebel and LUXEON Rebel ES Assembly and Handling Information Introduction This application brief covers recommended board designs and assembly procedures for LUXEON Rebel * LEDs and highly efficient LUXEON Rebel ES LEDs (part LXML-PWN2 and LXML-PWC2). * LUXEON Rebel and LUXEON Rebel ES are revolutionary, ultra-compact, surface mount, high-power LEDs. Both offer a compact package with high lumen output and superior thermal performance. The compact design allows close packing for maximum light output per unit area of board space while retaining high efficacy and maximum lumen maintenance. Proper handling, board design, and thermal management are required in order to ensure high optical output and long LED lumen maintenance times. * Since LUXEON Rebel and LUXEON Rebel ES LEDs have very similar form factors, most handling requirements and board design recommendations discussed in this Application Brief apply to both LED * types. Any differences in handling requirements between LUXEON Rebel and LUXEON Rebel ES are clearly marked. * LUXEON Rebel ES part LXML-PWN2 and LXML-PWC2Table of Contents 1. Component .............................................................................................................................................................. 3 1.1. Description ..................................................................................................................................................... 3 1.2. Optical Center ............................................................................................................................................... 3 1.3 Lens Handling ................................................................................................................................................. 7 1.4 Lens cleaning .................................................................................................................................................. 7 1.5 Electrical Isolation ......................................................................................................................................... 7 2. Board Design Rules ................................................................................................................................................ 8 2.1 PCB Requirements ........................................................................................................................................ 8 2.2 LUXEON Rebel Footprint and Land Pattern ......................................................................................... 8 2.3 Surface Finishing ..........................................................................................................................................10 2.4 LUXEON Rebel Close Proximity Placement........................................................................................10 3. FR4-Based Boards .................................................................................................................................................10 3.1 Material Properties .....................................................................................................................................10 3.2 Optimal Thermal Design ............................................................................................................................10 3.3 Thermal Via Design .....................................................................................................................................12 3.4 Component Spacing ....................................................................................................................................14 3.5 Thermal Resistance .....................................................................................................................................15 3.6 FR4 Board Handling ....................................................................................................................................19 4. MCPCB Board design ...........................................................................................................................................21 5. Assembly Process Recommendations and Parameters ................................................................................23 5.1 Stencil Design ...............................................................................................................................................23 5.2 Solder Paste ..................................................................................................................................................24 5.3 Pick and Place Nozzle ................................................................................................................................24 5.4 Pick and Place Machine Optimization .....................................................................................................27 5.5 Placement Accuracy ....................................................................................................................................30 5.6 Reflow Profile ...............................................................................................................................................31 5.7 Reflow Accuracy ..........................................................................................................................................32 5.8 Void Inspection and Solderability Indicators .........................................................................................33 6. JEDEC Moisture Sensitivity Level ......................................................................................................................35 7. Product Packaging Considerations Chemical Compatibility ....................................................................36 LUXEON Rebel Assembly and Handling Application Brief AB32 (10/07/30) 2