X-On Electronics has gained recognition as a prominent supplier of MX25R512FM1IL0 NOR Flash across the USA, India, Europe, Australia, and various other global locations. MX25R512FM1IL0 NOR Flash are a product manufactured by Macronix. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

MX25R512FM1IL0 Macronix

MX25R512FM1IL0 electronic component of Macronix
Images are for reference only
See Product Specifications
Part No.MX25R512FM1IL0
Manufacturer: Macronix
Category: NOR Flash
Description: Ultra Low Power, 512K-BIT (x 1/x 2/x 4)CMOS MXSMIO (Serial Multi I/O)Flash Memory
Datasheet: MX25R512FM1IL0 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
102: USD 0.3366 ea
Line Total: USD 34.33 
Availability - 0
MOQ: 102  Multiples: 98
Pack Size: 98
Availability Price Quantity
0
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 102
Multiples : 98
102 : USD 0.3366
392 : USD 0.3241
1470 : USD 0.3117
2450 : USD 0.3117
4900 : USD 0.3117

0
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 112
Multiples : 1
112 : USD 0.7327
500 : USD 0.3457

   
Manufacturer
Product Category
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We are delighted to provide the MX25R512FM1IL0 from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25R512FM1IL0 and other electronic components in the NOR Flash category and beyond.

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MX25R512F MX25R512F ULTRA LOW POWER, 512K-BIT x 1/x 2/x 4 CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY Key Features Ultra Low Power Mode and High Performance Mode Wide Range VCC 1.65V-3.6V for Read, Erase and Program Operations Unique ID and Secure OTP Support Multi I/O Support - Single I/O, Dual I/O and Quad I/O Program Suspend/Resume & Erase Suspend/Resume P/N: PM2189 REV. 1.1, SEP. 18, 2015 1MX25R512F Contents 1. FEATURES ..............................................................................................................................................................4 2. GENERAL DESCRIPTION .....................................................................................................................................6 Table 1. Additional Feature ..........................................................................................................................7 3. PIN CONFIGURATIONS .........................................................................................................................................8 4. PIN DESCRIPTION ..................................................................................................................................................8 5. BLOCK DIAGRAM ...................................................................................................................................................9 6. DATA PROTECTION ..............................................................................................................................................10 Table 2. Protected Area Sizes ................................................................................................................... 11 Table 3. 8K-bit Secured OTP Definition ....................................................................................................12 7. MEMORY ORGANIZATION ...................................................................................................................................13 Table 4. Memory Organization ..................................................................................................................13 8. DEVICE OPERATION ............................................................................................................................................14 9. HOLD FEATURE ....................................................................................................................................................16 10. COMMAND DESCRIPTION .................................................................................................................................17 Table 5. Command Set ..............................................................................................................................17 10-1. Write Enable (WREN) .............................................................................................................................. 20 10-2. Write Disable (WRDI) ............................................................................................................................... 21 10-3. Read Identification (RDID) ....................................................................................................................... 22 10-4. Read Electronic Signature (RES) ............................................................................................................ 23 10-5. Read Electronic Manufacturer ID & Device ID (REMS) ........................................................................... 24 10-6. ID Read .................................................................................................................................................... 25 Table 6. ID Definitions ..............................................................................................................................25 10-7. Read Status Register (RDSR) ................................................................................................................. 26 10-8. Read Configuration Register (RDCR) ...................................................................................................... 31 10-9. Write Status Register (WRSR) ................................................................................................................. 32 Table 7. Protection Modes .........................................................................................................................33 10-10. Read Data Bytes (READ) ........................................................................................................................ 36 10-11. Read Data Bytes at Higher Speed (FAST READ) .................................................................................. 37 10-12. Dual Read Mode (DREAD) ...................................................................................................................... 38 10-13. 2 x I/O Read Mode (2READ) ................................................................................................................... 39 10-14. Quad Read Mode (QREAD) .................................................................................................................... 40 10-15. 4 x I/O Read Mode (4READ) ................................................................................................................... 41 10-16. Burst Read ............................................................................................................................................... 43 10-17. Performance Enhance Mode ................................................................................................................... 44 10-18. Sector Erase (SE) .................................................................................................................................... 46 10-19. Block Erase (BE32K) ............................................................................................................................... 47 10-20. Block Erase (BE) ..................................................................................................................................... 48 10-21. Chip Erase (CE) ....................................................................................................................................... 49 10-22. Page Program (PP) ................................................................................................................................. 50 10-23. 4 x I/O Page Program (4PP) .................................................................................................................... 51 10-24. Deep Power-down (DP) ........................................................................................................................... 52 10-25. Enter Secured OTP (ENSO) .................................................................................................................... 53 P/N: PM2189 REV. 1.1, SEP. 18, 2015 2

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Macronix International
MX7
MXA
MXIC(Macronix)
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