X-On Electronics has gained recognition as a prominent supplier of MX25U4033EBAI-12G across the USA, India, Europe, Australia, and various other global locations. MX25U4033EBAI-12G are a product manufactured by Macronix. We provide cost-effective solutions for MX25U4033EBAI-12G, ensuring timely deliveries around the world.

MX25U4033EBAI-12G Macronix

MX25U4033EBAI-12G electronic component of Macronix
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Part No.MX25U4033EBAI-12G
Manufacturer: Macronix
Category: Unclassified
Description: 4M-BIT [X 1/X 2/X 4] 1.8V CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY
Datasheet: MX25U4033EBAI-12G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
6000: USD 0.2951 ea
Line Total: USD 1770.6 
Availability - 0
MOQ: 6000  Multiples: 6000
Pack Size: 6000
Availability Price Quantity
0
Ship by Fri. 15 Nov to Thu. 21 Nov
MOQ : 6000
Multiples : 6000
6000 : USD 0.2951

   
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We are delighted to provide the MX25U4033EBAI-12G from our Macronix manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MX25U4033EBAI-12G and other electronic components in the Macronix manufacturer and beyond.

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MX25U4033E MX25U4033E 1.8V, 4M-BIT x 1/x 2/x 4 CMOS MXSMIO (SERIAL MULTI I/O) FLASH MEMORY Key Features HOLD feature Multi I/O Support - Single I/O, Dual I/O and Quad I/O Auto Erase and Auto Program Algorithm Low Power Consumption P/N: PM1755 REV. 1.9, JAN. 12, 2016 11MX25U4033E Contents 1. FEATURES ..............................................................................................................................................................6 2. GENERAL DESCRIPTION ......................................................................................................................................7 Table 1. Additional Feature Comparison .................................................................................................... 7 3. PIN CONFIGURATIONS .........................................................................................................................................8 4. PIN DESCRIPTION ..................................................................................................................................................8 5. BLOCK DIAGRAM ...................................................................................................................................................9 6. DATA PROTECTION ..............................................................................................................................................10 Table 2. Protected Area Sizes .................................................................................................................. 11 Table 3. 4K-bit Secured OTP Definition ................................................................................................... 11 7. MEMORY ORGANIZATION ...................................................................................................................................12 Table 4. Memory Organization ................................................................................................................. 12 8. DEVICE OPERATION ............................................................................................................................................13 Figure 1. Serial Modes Supported ........................................................................................................... 13 9. HOLD FEATURE ....................................................................................................................................................14 Figure 2. Hold Condition Operation ........................................................................................................ 14 10. COMMAND DESCRIPTION .................................................................................................................................15 Table 5. Command Set ............................................................................................................................15 10-1. Write Enable (WREN) ..............................................................................................................................17 10-2. Write Disable (WRDI) ..............................................................................................................................17 10-3. Read Identification (RDID) .......................................................................................................................17 10-4. Read Status Register (RDSR) .................................................................................................................17 Table 6. Status Register ...........................................................................................................................21 10-5. Write Status Register (WRSR) ................................................................................................................ 22 Table 7. Protection Modes .......................................................................................................................22 10-6. Read Data Bytes (READ) ........................................................................................................................23 10-7. Read Data Bytes at Higher Speed (FAST READ) .................................................................................. 23 10-8. 2 x I/O Read Mode (2READ) ...................................................................................................................23 10-9. 4 x I/O Read Mode (4READ) ...................................................................................................................24 10-10. Performance Enhance Mode ...................................................................................................................25 10-11. Sector Erase (SE) ....................................................................................................................................25 10-12. Block Erase (BE32K) ...............................................................................................................................26 10-13. Block Erase (BE) .....................................................................................................................................26 10-14. Chip Erase (CE) .......................................................................................................................................26 10-15. Page Program (PP) .................................................................................................................................27 10-16. 4 x I/O Page Program (4PP) ....................................................................................................................27 10-17. Deep Power-down (DP) ...........................................................................................................................27 10-18. Release from Deep Power-down (RDP), Read Electronic Signature (RES) ........................................... 28 10-19. Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4) ......................................... 28 Table 8. ID Definitions .............................................................................................................................29 P/N: PM1755 REV. 1.9, JAN. 12, 2016 22

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