CMBA054949 Series Model : BGA Heat Sink For North Bridge Chip set Specification CMBA054949 Series 1.Material : CU1100 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base (thickness) : 2.6mm 3.Finish: Antioxidant Treatment 4. Accessory : Push Pin : Plastic (UL94-V0) Thermal pad : T725 or others Performance Heat Source (LxW) 15x15 7.2 0.24 6.6 0.22 6.0 0.20 5.4 0.18 H=12 4.8 0.16 4.2 0.14 H=21 0.12 3.6 H=33 3.0 0.10 2.4 0.08 1.8 0.06 1.2 0.04 0.6 0.02 0.0 0.00 0 100 200 300 400 500 600 700 800 900 100 0 Air Velocity (LFM) No.5, Ming Lung Road ,Yang Mei , Taiwan 32663 website : X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for malico manufacturer: Other Similar products are found below : MBH30001-13L/2.0 CMBA024949 MBH375002-12P/2.6 CEBF0145451601-00 CL-Y-35X35 MBH42.5002-12P/2.6