SOLDER BALLS for BGA Reballing High quality Solder Balls are available directly from MARTIN for reballing using MARTINs MINIOVEN 04. MARTIN Solder Balls are packaged under Argon inert gas atmospheres in quantities of up to 50.000 to prevent oxidation and promote a superior reballing process. Oxidation prevents solder alloys from wetting properly during the soldering process, enables voiding and jeopardizes the Rework process. MARTINs MINIOVEN 04 is a robust and easy to use dedicated reballing tool with an integrated soldering process controller. A prepared SMD component is loaded into the reballing fixture. The fixture pre-aligns the SMD with a stencil that enables poured Solder Balls to mate with the SMDs interconnecting pads and allows excess Solder Balls to be collected. The SMD and properly aligned Solder Balls housed within the reballing fixture are loaded into the MARTIN MINIOVEN 04 and reflowed under precise control. Fetaures Technical Data Lead Free(SnAg3,5Cu0,5) All Solder Ball boxes have quantity of 50.000pcs Size Range: 0,2 1,0 mm 0,01 mm and are prefilled with dry, inert Argon gas. Alloy: Sn Balance, Ag 3,0 4,0% Cu 0,4 0,6% Melting Point: 217-220 C Storage life of closed boxes is 12 months, Density: 7,37 g/cm after opening 6 months Leaded (SnPb37) Size Range: 0,2 1,0 mm 0,01 mm Alloy: Pb Balance, Sn 62,5-63,5 Melting Point: 183 C Density: 8,4 g/cm MARTIN GmbH Fon: +49 (0)8153 9329-30 We refer to our delivery conditions SOLDER BALLS-e Argelsrieder Feld 1b Fax.: +49 (0)8153 9329-39 Subject to change without notice V 2013 06 27.docx 82234 Wessling / Germany Web: www.martin-smt.de SOLDER BALLS for BGA Reballing Selection of Solder Ball Types form Stock VD90.5004 Solder Balls, 50,000 pc, CSP 1 piece Sn63Pb37, 250m (= 3,5g) VD90.5004 VD90.5104 Solder Balls, 50,000 pc, lead free CSP 1 piece Sn96.5Ag3Cu0.5 250m (=3g) VD90.5104 VD90.5005 Solder Balls, 50,000 pc, CSP 1 piece Sn63Pb37, 300m (= 6g) VD90.5005 VD90.5105 Solder Balls, 50,000 pc, lead free CSP 300m 1 piece Sn96.5Ag3Cu0.5 300m (=5.2g) Lead free VD90.5105 VD90.5011 Solder Balls, 50,000 pc, CCSP 1 piece Sn10Pb90, 300m (= 7.6g) VD90.5011 VD90.5115 Solder Balls, 50,000 pc, lead free CSP 1 piece Sn96.5Ag3Cu0.5 , 350m (=7.5g) VD90.5115 VD90.5008 Solder Balls, 50,000 pc, CSP 400 1 piece Sn63Pb37, 400m (= 14g) VD90.5008 VD90.5108 Solder Balls, 50,000 pc, lead free CSP 1 piece Sn96.5Ag3Cu0.5 , 400m (=12.5g) VD90.5108 VD90.5013 Solder Balls, 50,000 pc, CCSP 1 piece Sn10Pb90, 400m (= 18g) VD90.5013 VD90.5010 Solder Balls, 50,000 pc, CSP 1 piece Sn63Pb37, 450m (= 20g) VD90.5010 VD90.5110 Solder Balls, 50,000 pc, lead free CSP 450m Lead free 1 piece Sn96,.5Ag3Cu0.5 , 450m (=18g) VD90.5110 VD90.5009 Solder Balls, 50,000 pc, CSP 1 piece Sn63Pb37, 500m (= 27g) VD90.5009 VD90.5109 Solder Balls, 50,000 pc, lead free CSP 500m 1 piece Sn96.5Ag3Cu0.5 ,500m (=24g) Lead free VD90.5109 VD90.5006 Solder Balls, 50,000 pc, BGA 1 piece Sn63Pb37, 600m (= 47g) VD90.5006 VD90.5106 Solder Balls, 50,000 pc, lead free BGA 600m 1 piece Sn96.5Ag3Cu0.5 , 600m (=42g) Lead free VD90.5106 VD90.5101 Solder Balls, 50,000 pc, lead free BGA 1 piece Sn96.5Ag3Cu0.5, 762m (=86g) VD90.5101 VD90.5001 Solder Balls, 50,000 pc, BGA 762m 1 piece Lead free Sn63Pb37, 762m (= 96g) VD90.5101 VD90.5002 Solder Balls, 50,000 pc, CBGA 1 piece Sn10Pb90, 889m (= 197g) VD90.5002