SP3222EB/SP3232EB True +3.0V to +5.5V RS-232 Transceivers FEATURES Meets true EIA/TIA-232-F Standards 1 16 VCC C1+ from a +3.0V to +5.5V power supply 250kbps Transmission Rate Under Load 2 15 GND V+ 1A Low Power Shutdown with C1- 3 Receivers active (SP3222EB) 14 T1OUT Interoperable with RS-232 down to a SP3232EB 4 C2+ 13 R1IN +2.7V power source Enhanced ESD Speci cations: 5 12 R1OUT C2- +15kV Human Body Model 6 11 V- T1IN +15kV IEC61000-4-2 Air Discharge +8kV IEC61000-4-2 Contact Discharge T2OUT 7 10 T2IN R2IN 8 9 R2OUT Now Available in Lead Free Packaging DESCRIPTION The SP3222EB/SP3232EB series is an RS-232 transceiver solution intended for portable or hand-held applications such as notebook or laptop computers. The SP3222EB/SP3232EB series has a high-ef ciency, charge-pump power supply that requires only 0.1F capacitors in 3.3V operation. This charge pump allows the SP3222EB/SP3232EB series to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3222EB/ SP3232EB are 2-driver/2-receiver devices. The ESD tolerance of the SP3222EB/SP3232EB devices is over +/-15kV for both Human Body Model and IEC61000-4-2 Air discharge test methods. The SP3222EB device has a low-power shutdown mode where the devices driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1A. SELECTION TABLE Device Power RS-232 RS-232 External Shutdown TTL of Supplies Drivers Receivers Components 3-State Pins SP3222EB +3.0V to 2 2 4 Capacitors Yes Yes 18, 20 +5.5V SP3232EB +3.0V to 2 2 4 Capacitors No No 16 +5.5V Exar Corporation 48720 Kato Road, Fremont CA, 94538 510-668-7017 www.exar.com SP3222EB/SP3232EB 103 081414 1ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the speci cations below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. V .......................................................-0.3V to +6.0V Power Dissipation per package CC o o V+ (NOTE 1).......................................-0.3V to +7.0V 20-pin SSOP (derate 9.25mW/ C above +70 C)..............750mW o o V- (NOTE 1)........................................+0.3V to -7.0V 18-pin SOIC (derate 15.7mW/ C above +70 C)..............1260mW o o V+ + V- (NOTE 1)...........................................+13V 20-pin TSSOP (derate 11.1mW/ C above +70 C).............890mW o o I (DC V or GND current).........................+100mA 16-pin SSOP (derate 9.69mW/ C above +70 C)...............775mW CC CC o o 16-pin Wide SOIC (derate 11.2mW/ C above +70 C)........900mW o o Input Voltages 16-pin TSSOP (derate 10.5mW/ C above +70 C)..............850mW o o TxIN, EN..............................................-0.3V to +6.0V 16-pin nSOIC (derate 13.57mW/ C above +70 C)...........1086mW RxIN...................................................................+15V Output Voltages Maximum Junction Temperature .......................................+125C TxOUT.............................................................+13.2V Thermal Resistance JA ..............................................100.4C/W RxOUT, .......................................-0.3V to (V +0.3V) Thermal Resistance JC ................................................19.0C/W CC Short-Circuit Duration TxOUT....................................................Continuous Storage Temperature......................-65C to +150C NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. NOTE 2: Driver Input hysteresis is typically 250mV. ELECTRICAL CHARACTERISTICS Unless otherwise noted, the following speci cations apply for V = +3.0V to +5.5V with T = T to T , CC AMB MIN MAX C1 - C4 = 0.1F. PARAMETER MIN. TYP. MAX. UNITS CONDITIONS DC CHARACTERISTICS Supply Current 0.3 1.0 mA no load, V = 3.3V, CC o T = 25 C, TxIN = GND or V AMB CC Shutdown Supply Current 1.0 10 A SHDN = GND, VCC = 3.3V, o T = 25 C, TxIN = Vcc or GND AMB LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW GND 0.8 V TxIN, EN, SHDN, Note 2 Input Logic Threshold HIGH 2.0 Vcc V Vcc = 3.3V, Note 2 Input Logic Threshold HIGH 2.4 Vcc V Vcc = 5.0V, Note 2 Input Leakage Current +0.01 +1.0 A TxIN, EN, SHDN, o T = +25 C, V = 0V to V AMB IN CC Output Leakage Current +0.05 +10 A Receivers disabled, V = 0V to V OUT CC Output Voltage LOW 0.4 V I = 1.6mA OUT Output Voltage HIGH V -0.6 V -0.1 V I = -1.0mA CC CC OUT DRIVER OUTPUTS Output Voltage Swing +5.0 +5.4 V All driver outputs loaded with 3k to o GND, T = +25 C AMB Exar Corporation 48720 Kato Road, Fremont CA, 94538 510-668-7017 www.exar.com SP3222EB/SP3232EB 103 081414 2