MC3672 3-Axis Accelerometer GENERAL DESCRIPTION FEATURES Range, Sampling & Power The MC3672, one of the worlds smallest accelerometer with 1.29x1.09x0.74mm 1.29 x 1.09 x 0.74 mm CSP package size, is an ultra-low power, low-noise, 2, 4, 8, 12 or 16g ranges integrated digital output 3-axis 8, 10 or 12-bit resolution with FIFO accelerometer with a feature set optimized o 14-bit single samples for wearables and consumer product Sample rate 14 - 1300 samples/sec motion sensing. Applications include o Sample trigger via internal oscillator, wearable consumer products, IoT devices, clock pin or software command user interface control, gaming motion input, Sniff and Wake modes electronic compass tilt compensation for o 0.4 A Sniff current 6Hz cell phones, game controllers, remote o Separate or combined sniff/wake controls and portable media products. Ultra-Low Power with 32 sample FIFO o 0.9 A typical current 25Hz o 1.6 A typical current 50Hz o 2.8 A typical current 100Hz Low noise and low power are inherent in o 36 A typical current 1300Hz the monolithic fabrication approach, where the MEMS accelerometer is integrated in a single-chip with the electronics integrated Simple System Integration circuit. I2C interface, up to 1 MHz SPI Interface, up to 8 MHz Single-chip 3D silicon MEMS In the MC3672 the internal sample rate can Low noise to 2.3mgRMS be set from 14 to 1300 samples / second. ROHS Compliant Specific tap or sample acquisition conditions can trigger an interrupt to a remote MCU. Alternatively, the device supports the reading of sample and event status via polling. Information furnished by MEMSIC is believed to be accurate and reliable. MEMSIC Semiconductor (Tianjin) Co., Ltd. However, no responsibility is assumed by MEMSIC for its use, or for any infringements of patents or other rights of third parties which may result Room 4-501, Financial Center, No. 158, West Third Road, from its use. No license is granted by implication or otherwise under any Tianjin Airport Economic Zone, Tianjin, China, 300308 patent or patent rights of MEMSIC. Tel: +86 022-59896226 www.memsic.com MEMSIC MC3672 APS-045-0018 v1.4 Page 1 of 83 Formal release date: 2020/07/08 TABLE OF CONTENTS 1 Ordering Information ........................................................................................................ 5 2 Functional Block Diagram ................................................................................................ 6 3 Packaging and Ball Description ....................................................................................... 7 3.1 Package Outline ................................................................................................................... 7 3.2 Package Orientation ............................................................................................................. 8 3.3 BALL Description ................................................................................................................. 9 3.4 Typical Application Circuits ................................................................................................ 10 3.5 Tape and Reel ................................................................................................................... 13 3.6 Soldering Profile ................................................................................................................. 15 3.7 Shipping and Handling Guidelines ..................................................................................... 15 3.8 Moisture Sensitivity Level Control ...................................................................................... 15 4 Specifications ................................................................................................................. 16 4.1 Absolute Maximum Ratings ................................................................................................ 16 4.2 Sensor Characteristics ....................................................................................................... 17 4.3 Electrical and Timing Characteristics .................................................................................. 18 4.3.1 Electrical Power and Internal Characteristics .................................................................. 18 4.3.2 Electrical Characteristics ................................................................................................ 19 4.3.3 I2C Timing Characteristics .............................................................................................. 20 4.3.4 SPI Timing Characteristics.............................................................................................. 21 5 General Operation ......................................................................................................... 22 5.1 Sensor Sampling ................................................................................................................ 22 5.2 Offset and Gain Calibration ................................................................................................ 22 5.3 Reset ................................................................................................................................. 22 5.4 Reload ............................................................................................................................... 24 5.5 Operational Modes ............................................................................................................. 25 5.6 Mode State Machine Flow .................................................................................................. 26 6 Interfaces ....................................................................................................................... 27 6.1 SPI vs I2C Operation Modes .............................................................................................. 27 6.2 I2C Physical Interface ........................................................................................................ 27 6.3 I2C Message Format .......................................................................................................... 28 6.4 SPI Physical Interface ........................................................................................................ 29 6.5 SPI 3-Wire Mode ................................................................................................................ 29 MEMSIC MC3672 APS-045-0018 v1.4 Page 2 of 83 Formal release date: 2020/07/08