Applications Systems Handpieces Tips & Cartridges SOLDERING Repetitive Coil Assembly + Handpiece = PS-HC1 TIPS production PS-800 soldering, Coil Assembly = PS-CA1(PS-800) PHT 37 geometries touch ups PS-800E or END VIEW OF PS-CA2 and Coil Assembly = PS-CA2 (PS-800E) Soldering System through-hole Coil Assembly + Handpiece = MFR-HPS PS-CA1 TIPS SFV 12 geometries MFR-PST Light/medium load * Production Soldering Coil Assembly = MFR-CA1 PS-CA2 & MFR-CA1 Tip System END VIEW OF MFR-CA1 Heavy load SOLDERING & REWORK Production MFR-SRC SFP 17 geometries soldering * CARTRIDGES rework & Soldering & Rework n RFP 7 geometries SMT removal Cartridge System Handpiece = MFR-HSR MFR-PTZ Handpiece = MFR-HPT Precision Tweezer, 0201 * n Soldering & Rework + TFP 3 geometries Packages System MFR-HSR CARTRIDGES & small TFP-BLP1, TFP-BLP2 discrete TFP-CNP1 components MFR-PTW Handpiece = MFR-HPT * Precision Tweezer System TFP tips are not interchangeable between MFR-HPT & MFR-HST MFR-STZ Handpiece = MFR-HST Discrete & TFP 5 geometries Standard Tweezer SOIC CARTRIDGES TFP-BLH3, TFP-BLH4, * + n Soldering & Rework components TFP-BLH5, TFP-BLH6, TFP-BLH7 System Handpiece = MFR-HDS Desoldering MFR-SDI / -SDX * through-hole Solder/Desolder Internal Pump + n from 0.67mm Solder/Desolder External Air (.26) O/D MFR-HDS are only to 2.44mm compatible with MFR-DSI, CARTRIDGES DFP 9 geometries (.096) O/D /-DSX, /-SDI, /-SDX MFR-DSI / -DSX * Desolder Internal Pump System Handpiece = MFR-HDS Desolder External Air System Handpieces MFR-HPS / MFR-HSR / MFR-HPT / MFR-HST are compatible and interchangeable with systems marked www.okinternational.com *Tip Cross Reference Upgrade Kits MFR-SFV/ MX-500 MFR-SFP PS-800 SP200 Add versatility to your MFR System. PS-800E Hand-piece Upgrade Kits can be ordered to compliment STTC-X25 SFV-CH10 PHT-XY0315 any of the MFR Systems. Kits include both the hand-piece SFP-CH10 SSC-X25A STTC-X38 SFP-CH15 SSC-X38A and workstand. STTC-X37 SFP-CH20 SFV-CH20 PHT-XY0335 STTC-X36 SFP-CH25 SFV-CH25 PHT-XY1335 SSC-X36A SFV-CH50 PHT-XY1384 STTC-X17 SFP-CH50 SSC-X17A MFR-PST-AD STTC-X22 SFP-CN04 STTC-X16 SFP-CN05 SFV-CN05 PHT-XY3035 SSC-X22A Production / Solder Tip Upgrade Kit STTC-X45 SFP-CNL04 SFV-CNL04 PHT-XY2017 STTC-X42 SFP-CHL20 STTC-X40 SFP-CNB04 MFR-SRC-AD STTC-X44 SFV-CNB05 PHT-XY2335 SFP-CNB05 SSC-X54A STTC-X99 SFP-CHB15 SFV-CHB15 PHT-XY0326 Solder / Rework Cartridge Upgrade Kit STTC-X46 SFP-BVL10 SMTC-X172 SFP-DRH05 SMTC-X167 SFP-DRH15 SSC-X67A SMTC-X147 SFP-DRH35 SSC-X39A MFR-PTZ-AD SMTC-X161 SFP-DRK50 SFV-DRK50 PHT-XY5477 SSC-X73A SMTC-X62 RFP-BL3 Precision Tweezer Upgrade Kit SMTC-X61 RFP-BL2 SMTC-X60 RFP-BL1 SMTC-X01 RFP-SL1 SMTC-X02 RFP-SL2 MFR-STZ-AD SMTC-X04 RFP-DL2 Standard Tweezer Upgrade Kit SMTC-X06 RFP-DL1 TATC-X01 TFP-CN1 MFR Tip Part Numbering Conductivity Factor Our new SmartHeat PowerTips have been specifically developed for Lead free applications. They offer high First Digit - Application performance at low tip idle temperatures, by optimizing the Denotes the primary conduction of the thermal energy through the design of the application of the tip or S F V tip geometries . cartridge: S = Soldering R = Rework T = Tweezer D = De solder S F P / R F P Second Digit - Substrate Denotes substrate material Hand Soldering & Rework B A (Damage tolerance): Product Guide F = FR4 / Glass Fiber The tip B is formed with multiple steps. This reduces its T = Temperature Sensitive diameter size and inhibits its ability to conduct thermal C = Ceramic energy efficiently to the joint. The tip A has a smooth progressive taper allowing good Third Digit - Class PS-800 & MFR Range conduction from the heater source to the substrate. Denotes performance characteristics: T F P The above diagram is a representation of how each tip P = Performance (Cartridge) performed when soldering a 2 layer board (light load) and a V = Value (Tip) 10 layer board (heavy load). The temperature was the same for both tests and a bench mark line added to signify the requirements of Lead free. This shows that by maintaining the source temperature (typically 370C) and just changing D F P the geometries you can achieve much better thermal performance.