Sn63/Pb37 No Clean Solder Paste
4860P Technical Data Sheet
4860P
Description
The MG 4860P No Clean Solder Paste is a no clean solder paste designed for surface mount applications
using a syringe dispensing method. The post soldering residues of 4860P are non-conductive, non-
corrosive and highly insulated.
Benefits
Low residues
Easily dispensed
Excellent wettability
Hard non-conductive residues
Solder Composition of MG 4860P Solder Paste
Sn63 alloy is the conventional eutectic solder used in most electronic assemblies. The Sn63 alloy
conforms and exceeds the impurity requirements of J-STD-006 and all other relevant international
standards.
Typical Analysis
Sn Pb Cu Ag Sb Bi In As Fe Ni Cd Al Zn Au
62.5- Bal. 0.030 0.020 0.050 0.050 0.050 0.010 0.010 0.005 0.001 0.001 0.001 0.002
63.5 Max Max Max Max Max Max Max Max Max Max Max Max
Particle Size
Sn63 alloy is 3( 45-25m and J -STD-005 powder distribution. Solder powder distribution is measured
utilizing laser diffraction, optical analysis and sieve analysis. Careful control of solder powder
manufacturing processes ensures the particles shape are 95% spherical minimum (aspect ratio < 1.5)
and that the alloy contains a typical maximum oxide level of 80 ppm.
Classification of Solder Powder by Particle Size
Powder Type Fines Majority Coarse Typical Mesh
<10% >80% >90% <1% 0%
3 20 25-45 45 50 325/500
Metal Loading
Typical metal loading for dispensing application is 87.0-88.0 %.
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Rev. Date: 25 August 2014 / Ver. 1.10Sn63/Pb37 No Clean Solder Paste
4860P Technical Data Sheet
4860P
Properties
MG 4860P Sn63/Pb37
Melting Point, C 183 E
Hardness, Brinell 14HB
Coefficient of Thermal Expansion 24.7
Tensile Strength, psi 4442
Density, g/cc 8.42
Electrical Resistivity , (o hm - cm) 14.5
Electrical Conductivity, 104/ohm-cm 6.9
Yield Strength, psi 3950
Total Elongation,% 48
Joint Shear Strength, at 0.1mm/min 20 C 23
Joint Shear Strength, at 0.1mm/min 100 C 14
Creep Strength, N/mm2 at 0.1mm/min 20 C 3.3
Property Specification Test Method
Flux Classification REL0 JSTD-004
Copper Mirror No removal of copper film IPC-TM-650 2.3.32
Corrosion Pass IPC-TM-650 2.6.15
SIR
JSTD-004 2.44 x 1010 ohms IPC-TM-650 2.6.3.3
Bellcore (Telecordia) 4.10 x 1010 ohms Bellcore GR-78-CORE 13.1.3
Electromigration Pass Bellcore GR-78-CORE 13.1.4
Post Reflow Flux Residue 45% TGA Analysis
Acid Value 110 IPC-TM-650 2.3.13
Metal Loading 88% IPC-TM-650 2.2.20
Viscosity
Brookfield (1), kcps 400+/-10% kcps IPC-TM-650 2.4.34 modified
Malcom (2), poise 850-1100 IPC-TM-650 2.4.34.3 modified
Slump Test
25 C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35
150 C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35
25 C, 0.33 vertical/horizontal 0.20 /0.20 IPC-TM-650 2.4.35
150 C, 0.33 vertical/horizontal 0.20/0.20 IPC-TM-650 2.4.35
Solder Ball Test Pass IPC-TM-650 2.4.43
Tack
Initial 85 gm JIS Z 3284
Tack retention @ 24 hr 90 gm JIS Z 3284
Tack retention @ 24 hr 82 gm JIS Z 3284
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Rev. Date: 25 August 2014 / Ver. 1.10