X-On Electronics has gained recognition as a prominent supplier of 4860P-35G Solder across the USA, India, Europe, Australia, and various other global locations. 4860P-35G Solder are a product manufactured by MG Chemicals. We provide cost-effective solutions for Solder, ensuring timely deliveries around the world.

4860P-35G MG Chemicals

4860P-35G electronic component of MG Chemicals
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See Product Specifications
Part No.4860P-35G
Manufacturer: MG Chemicals
Category: Solder
Description: Solder Leaded Solder Paste Sn63/Pb37, No Clean
Datasheet: 4860P-35G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 40.7608 ea
Line Total: USD 40.76 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Mon. 30 Dec to Fri. 03 Jan
MOQ : 5
Multiples : 5
5 : USD 27.8618
10 : USD 26.4699
20 : USD 25.1396
40 : USD 23.8833
50 : USD 22.6885

0
Ship by Mon. 30 Dec to Fri. 03 Jan
MOQ : 1
Multiples : 1
1 : USD 21.674

0
Ship by Mon. 30 Dec to Fri. 03 Jan
MOQ : 1
Multiples : 1
1 : USD 40.7608
30 : USD 37.2131
60 : USD 36.0201

0
Ship by Mon. 30 Dec to Fri. 03 Jan
MOQ : 5
Multiples : 5
5 : USD 36.3032

   
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Product Category
RoHS - XON
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Contains Lead
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the 4860P-35G from our Solder category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 4860P-35G and other electronic components in the Solder category and beyond.

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Sn63/Pb37 No Clean Solder Paste 4860P Technical Data Sheet 4860P Description The MG 4860P No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method. The post soldering residues of 4860P are non-conductive, non- corrosive and highly insulated. Benefits Low residues Easily dispensed Excellent wettability Hard non-conductive residues Solder Composition of MG 4860P Solder Paste Sn63 alloy is the conventional eutectic solder used in most electronic assemblies. The Sn63 alloy conforms and exceeds the impurity requirements of J-STD-006 and all other relevant international standards. Typical Analysis Sn Pb Cu Ag Sb Bi In As Fe Ni Cd Al Zn Au 62.5- Bal. 0.030 0.020 0.050 0.050 0.050 0.010 0.010 0.005 0.001 0.001 0.001 0.002 63.5 Max Max Max Max Max Max Max Max Max Max Max Max Particle Size Sn63 alloy is 3( 45-25m and J -STD-005 powder distribution. Solder powder distribution is measured utilizing laser diffraction, optical analysis and sieve analysis. Careful control of solder powder manufacturing processes ensures the particles shape are 95% spherical minimum (aspect ratio < 1.5) and that the alloy contains a typical maximum oxide level of 80 ppm. Classification of Solder Powder by Particle Size Powder Type Fines Majority Coarse Typical Mesh <10% >80% >90% <1% 0% 3 20 25-45 45 50 325/500 Metal Loading Typical metal loading for dispensing application is 87.0-88.0 %. Page 1 of 6 Rev. Date: 25 August 2014 / Ver. 1.10Sn63/Pb37 No Clean Solder Paste 4860P Technical Data Sheet 4860P Properties MG 4860P Sn63/Pb37 Melting Point, C 183 E Hardness, Brinell 14HB Coefficient of Thermal Expansion 24.7 Tensile Strength, psi 4442 Density, g/cc 8.42 Electrical Resistivity , (o hm - cm) 14.5 Electrical Conductivity, 104/ohm-cm 6.9 Yield Strength, psi 3950 Total Elongation,% 48 Joint Shear Strength, at 0.1mm/min 20 C 23 Joint Shear Strength, at 0.1mm/min 100 C 14 Creep Strength, N/mm2 at 0.1mm/min 20 C 3.3 Property Specification Test Method Flux Classification REL0 JSTD-004 Copper Mirror No removal of copper film IPC-TM-650 2.3.32 Corrosion Pass IPC-TM-650 2.6.15 SIR JSTD-004 2.44 x 1010 ohms IPC-TM-650 2.6.3.3 Bellcore (Telecordia) 4.10 x 1010 ohms Bellcore GR-78-CORE 13.1.3 Electromigration Pass Bellcore GR-78-CORE 13.1.4 Post Reflow Flux Residue 45% TGA Analysis Acid Value 110 IPC-TM-650 2.3.13 Metal Loading 88% IPC-TM-650 2.2.20 Viscosity Brookfield (1), kcps 400+/-10% kcps IPC-TM-650 2.4.34 modified Malcom (2), poise 850-1100 IPC-TM-650 2.4.34.3 modified Slump Test 25 C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35 150 C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35 25 C, 0.33 vertical/horizontal 0.20 /0.20 IPC-TM-650 2.4.35 150 C, 0.33 vertical/horizontal 0.20/0.20 IPC-TM-650 2.4.35 Solder Ball Test Pass IPC-TM-650 2.4.43 Tack Initial 85 gm JIS Z 3284 Tack retention @ 24 hr 90 gm JIS Z 3284 Tack retention @ 24 hr 82 gm JIS Z 3284 Page 2 of 6 Rev. Date: 25 August 2014 / Ver. 1.10

Tariff Desc

8311.30.00 -Coated rods and cored wire, of base metal, for soldering, brazing or welding by flame
MG Chemical
MG Chemicals
MG Chemicals.
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