8329TFM Technical Data Sheet Thermally Conductive Epoxy Adhesive Description 8329TFM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS. Features and Benefits Thermal conductivity: 1.1 W/(mK) 1:1 mix ratio Working life: 45 minutes Cure time: 24 hours at room temperature or 2 hours at 65 C (149 F) Provides strong electrical insulation High tensile strength Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons Shelf life: 3 years RoHS 3 compliant Page 1 ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008 Date: 13 Septemeber 2018 / Ver. 2.02 8329TFM Usage Parameters Properties Value Working life 22 C 72 F 45 min a) Shelf life 22 C 72 F 3 y Service cure 22 C 72 F 5 h Full cure 22 C 72 F 24 h Full cure 65 C 149 F 2 h Full cure 80 C 176 F 1 h Full cure 100 C 212 F 30 min Temperature Ranges Properties Value Constant service temperature -40 to 150 C -40 to 302 F a) Maximum intermittent temperature 175 C 347 F Storage temperature 22 to 27 C 72 to 81 F a) Temperature that can be withstood for short periods without sustaining damage. Page 2 ISO 9001:2008 Registered Quality System. Burlington, Ontario, Canada SAI Global File: 004008 Date: 13 Septemeber 2018 / Ver. 2.02