860-150G MG Chemicals

860 Technical Data Sheet Silicone Heat Transfer Compound Description 860 is a thermally conductive silicone paste. It is designed to reduce thermal resistance between irregular metal surfaces. It is most commonly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components. Features and Benefits High thermal conductivity High dielectric strength Broad service temperature of -40 to 200 C (-40 to 392 F) Excellent corrosion resistance Non-bleeding Non-electrically conductive Long service life Usage Parameters Properties Value Shelf life 5 y a) 2 2 Theoretical coverage for 4G pouch <656 cm <0.70 ft a) Estimate based on 25 m 1 mil thickness and 100% transfer efficiency. Temperature Ranges Properties Value Constant service temperature -40 to 200 C -40 to 392 F Storage temperature limits -10 to 40 C 14 to 104 F IS0 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 Date: 03 October 2018 / Ver. 2.00 Page 1860 Properties Thermal Properties Method Value Thermal conductivity 25 C 77 F Hot wire method 0.66 W/(mK) a) -3 2 Contact thermal resistance 25 C 77 F ASTM E 1225 0.57 x 10 (m K)/W Electrical Properties Method Value 15 ASTM D 257 1.5 10 cm Volume resistivity ( v) -16 ASTM D 257 6.7 x 10 S/cm Volume conductivity ( v) Dielectric strength 0.254 mm 0.01 mil ASTM D 149 400 V/mil 16 kV/mm Dielectric constant ASTM D 150 3.81 Dissipation factor ASTM D 150 0.0032 Grease Properties Method Value Evaporation loss, 22 h 165 C 329 F ASTM D 2595 0.1% Oil separation, 30 h 165 C 329 F ASTM D 6184 0.7% Dropping point ASTM D 566 >260 C >500 F b) Water washout 38 C 100 F ASTM D 1264 0.1% Worked penetration, 60 strokes ASTM D 1403 303 a) Tested with stainless steel plates. b) Bearing dried at 77 C 171 F . IS0 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 Date: 03 October 2018 / Ver. 2.00 Page 2