9400 1-part Epoxy, Electrically Conductive Adhesive, Low T g 9400 is an electrically conductive, silver-lfi led, 1-part epoxy adhesive with a low cure temperature. It is smooth, thixotropic, non-sagging, and bonds well to a wide variety of substances. It has an unlimited working life at room temperature. This product can create electrically conductive bonds where soldering is not an option, such as when bonding to heat-sensitive components, glass, soft metals, or conductive polymers. It also works well in semi-conductor packaging, micro- electronic attachment and lid-sealing, and as a die attach for small chips, LEDs and diodes. It does not require mixing and can be readily used in manual, pneumatic and robotic dispensing processes. 9400 has been formulated to have a low T , which g allows for minimal stress on substrates during temperature changes. For a higher T , use 9410. g Features and Benefits Cured Properties -4 Creates strong permanent electrical Resistivity 3.1 x 10 cm connections Hardness 74 D 2 No mixing and unlimited working time Tensile Strength 2.9 N/mm 2 Compressive Strength 18 N/mm Low cure temperature of 70 C 2 Lap Shear (stainless steel) 2.9 N/mm Room temperature storage 2 (aluminum) 3.2 N/mm Suitable for automated dispensing Glass Transition Temperature (T ) 36 C g CTE Prior T 76 ppm/C g Available Packaging CTE After T 100 ppm/C g Thermal Conductivity 25 C 4.7 W/(mK) Cat. No. Packaging Net Vol. Net Wt. Service Temperature Range -55140 C 9400-3ML Syringe 3 mL 9.42 g 9400-30ML Cartridge 30 mL 94.2 g Usage Parameters Working Time Unlimited Contact Information Cure Times 2 h 70 C MG Chemicals, 1210 Corporate Drive 30 min 80 C Burlington, Ontario, Canada L7L 5R6 Email: support mgchemicals.com Uncured Properties Phone: Nor th America: +(1)80 0 -3 40 - 0772 International: +(1) 905-331-1396 Viscosity 25 C Thixotropic paste Europe: +(44)1663 362888 Density 3.14 g/mL ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 02 March 2020 / Ver. 3.0 19400 Application Instructions Cure Instructions Read the product SDS before using this product The product will not cure at room temperature. (downloadable at www.mgchemicals.com). Cure the adhesive in an oven at one of these time/temperature options: Recommended Preparation 2 h 70 C 30 min 80 C Clean the substrate with Isopropyl Alcohol, MG 824, so the surface is free of oils, dust, and other residues. Storage and Handling Syringe or Cartridge Store in a dry area, away from sunlight (see SDS). To maximize shelf life, recap product firmly when 1. Twist and remove the cap from the cartridge or not in use and keep frozen. If exposed to freezing syringe. Do not discard cap. temperatures, keep product at room temperature for 2. Dispense the adhesive evenly to both surfaces. 2 hours prior to use. a. For 30 mL size, insert the cartridge in the 8DG-30-1 dispensing gun (see Dispensing 9400-3ML Accessories Application Guide). Shelf Life 22 C 6 months 3. To stop the flow, pull back on the plunger. Shelf Life -10 C 1 y 4. Clean nozzle to prevent contamination and material buildup. 9400-30ML 5. Replace the cap on the cartridge or syringe. Shelf Life 22 C 6 months Dispensing Accessories Shelf Life -10 C 9 months Consult the table below for accessory selection. See the Dispensing Accessories Application Guide for usage instructions. Cat. No. Dispensing Gun Static Mixer 9400-3ML N/A N/A 9400-30ML 8DG-30-1 N/A Disclaimer This information is believed to be accurate. It is intended for professional end-users who have the skills required to evaluate and use the data properly. M.G. Chemicals Ltd. does not guarantee the accuracy of the data and assumes no liability in connection with damages incurred while using it. ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 02 March 2020 / Ver. 3.0 2