1N5188US Microchip

WWW.Microsemi .COM 1N5186US 1N5190US 1N5186US thru 1N5190US VOIDLESS-HERMETICALLY SEALED SURFACE MOUNT FAST RECOVERY SCOTTSDALE DIVISION GLASS RECTIFIERS DESCRIPTION APPEARANCE This fast recovery rectifier diode series is ideal for high-reliability applications Package E where a failure cannot be tolerated. These industry-recognized 3.0 Amp rated or D-5B rectifiers for working peak reverse voltages from 100 to 600 volts are hermetically sealed with voidless-glass construction using an internal Category I metallurgical bond. These devices are also available in military qualified axial-leaded packages by deleting the US suffix. Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including fast and ultrafast device types in both through-hole and surface mount packages. IMPORTANT: For the most current data, consult MICROSEMIs website: WWW.Microsemi .COM 1N5186US 1N5190US 1N5186US thru 1N5190US VOIDLESS-HERMETICALLY SEALED SURFACE MOUNT FAST RECOVERY SCOTTSDALE DIVISION GLASS RECTIFIERS SYMBOLS & DEFINITIONS Symbol Definition Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. V BR Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating V RWM temperature range. V Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. F Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and I R temperature. Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified decay point after a peak reverse t rr current occurs. PACKAGE DIMENSIONS NOTE: This Package Outline has also previously PAD LAYOUT been identified as D-5B INCHES mm INCHES mm A 0.288 7.32 MIN MAX MIN MAX B 0.070 1.78 BL .200 .225 5.08 5.72 C 0.155 3.94 BD .137 .148 3.48 3.76 Note: If mounting requires adhesive ECT .019 .028 0.48 0.711 separate from the solder, an additional 0.080 inch diameter contact may be S .003 --- 0.08 --- placed in the center between the pads as an optional spot for cement. Copyright 2009 Microsemi Page 2 10-30-2009 REV C, SD61A Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503