93LC66AT-I/MNY Microchip

93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C 4K Microwire Compatible Serial EEPROM Device Selection Table CC Range ORG Pin Word Size Temp Ranges Packages Part Number V 93AA66A 1.8-5.5 No 8-bit I P, SN, ST, MS, OT, MC, MN 93AA66B 1.8-5-5 No 16-bit I P, SN, ST, MS, OT, MC, MN 93LC66A 2.5-5.5 No 8-bit I, E P, SN, ST, MS, OT, MC, MN 93LC66B 2.5-5.5 No 16-bit I, E P, SN, ST, MS, OT, MC, MN 93C66A 4.5-5.5 No 8-bit I, E P, SN, ST, MS, OT, MC, MN 93C66B 4.5-5.5 No 16-bit I, E P, SN, ST, MS, OT, MC, MN 93AA66C 1.8-5.5 Yes 8- or 16-bit I P, SN, ST, MS, MC, MN 93LC66C 2.5-5.5 Yes 8- or 16-bit I, E P, SN, ST, MS, MC, MN 93C66C 4.5-5.5 Yes 8- or 16-bit I, E P, SN, ST, MS, MC, MN Features: Pin Function Table Name Function Low-Power CMOS Technology ORG Pin to Select Word Size for 66C Version CS Chip Select 512 x 8-bit Organization A Devices (no ORG) CLK Serial Data Clock 256 x 16-bit organization B Devices (no ORG) DI Serial Data Input Self-tImed Erase/Write Cycles (including DO Serial Data Output Auto-Erase) VSS Ground Automatic Erase All (ERAL) Before Write All NC No internal connection (WRAL) ORG Memory Configuration Power-On/Off Data Protection Circuitry VCC Power Supply Industry Standard 3-Wire Serial I/O Device Status Signal (Ready/Busy) Description: Sequential Read Function 1,000,000 Erase/Write Cycles The Microchip Technology Inc. 93XX66A/B/C devices Data Retention > 200 Years are 4Kbit low-voltage serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as Pb-free and RoHS Compliant the 93AA66C, 93LC66C or 93C66C are dependent Temperature Ranges Supported: upon external logic levels driving the ORG pin to set - Industrial (I) -40C to +85C word size. For dedicated 8-bit communication, the - Automotive (E) -40C to +125C 93XX66A devices are available, while the 93XX66B devices provide dedicated 16-bit communication. Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN/TDFN and 8-lead TSSOP. All packages are Pb-free (Matte Tin) finish. 2003-2011 Microchip Technology Inc. DS21795E-page 193AA66A/B/C, 93LC66A/B/C, 93C66A/B/C Package Types (not to scale) ROTATED SOIC PDIP/SOIC (ex: 93LC46BX) (P, SN) NC 1 8 ORG* CS 1 8 VCC VCC 2 7 VSS CLK 2 7 NC CS 3 6 DO DI 3 6 ORG* CLK 4 5 DI DO 4 5 VSS TSSOP/MSOP SOT-23 (ST, MS) (OT) 1 8 CS VCC 1 6 DO VCC 2 7 CLK NC 2 3 6 5 DI ORG* VSS CS 5 4 DO VSS 3 4 DI CLK DFN/TDFN (MC, MN) 1 CS 8 VCC 7 NC CLK 2 6 ORG* DI 3 DO 4 5 VSS *ORG pin is NC on A/B devices. DS21795E-page 2 2003-2011 Microchip Technology Inc.