X-On Electronics has gained recognition as a prominent supplier of AGLN125V2-VQG100 FPGA - Field Programmable Gate Array across the USA, India, Europe, Australia, and various other global locations. AGLN125V2-VQG100 FPGA - Field Programmable Gate Array are a product manufactured by Microchip. We provide cost-effective solutions for FPGA - Field Programmable Gate Array, ensuring timely deliveries around the world.

AGLN125V2-VQG100 Microchip

AGLN125V2-VQG100 electronic component of Microchip
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Part No.AGLN125V2-VQG100
Manufacturer: Microchip
Category: FPGA - Field Programmable Gate Array
Description: FPGA - Field Programmable Gate Array 125K System Gates
Datasheet: AGLN125V2-VQG100 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 26.3087 ea
Line Total: USD 26.31 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 1
Multiples : 1
1 : USD 26.3087
25 : USD 15.7964
100 : USD 12.6431

0
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 180
Multiples : 180
180 : USD 15.8953

0
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 1
Multiples : 1
1 : USD 13.1433
30 : USD 12.7484

   
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Revision 17 IGLOO nano Low Power Flash FPGAs with Flash*Freeze Technology High-Performance Routing Hierarchy Features and Benefits Segmented, Hierarchical Routing and Clock Structure Low Power Advanced I/Os nanoPower ConsumptionIndustrys Lowest Power 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation 1.2 V to 1.5 V Core Voltage Support for Low Power Bank-Selectable I/O Voltagesup to 4 Banks per Chip Supports Single-Voltage System Operation Single-Ended I/O Standards: LVTTL, LVCMOS Low Power Active FPGA Operation 3.3V /2.5V / 1.8V /1.5V/1.2V Flash*Freeze Technology Enables Ultra-Low Power Wide Range Power Supply Voltage Support per JESD8-B, Consumption while Maintaining FPGA Content Allowing I/Os to Operate from 2.7 V to 3.6 V Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode Wide Range Power Supply Voltage Support per JESD8-12, Allowing I/Os to Operate from 1.14 V to 1.575 V Small Footprint Packages I/O Registers on Input, Output, and Enable Paths As Small as 3x3 mm in Size Selectable Schmitt Trigger Inputs Wide Range of Features Hot-Swappable and Cold-Sparing I/Os Programmable Output Slew Rate and Drive Strength 10,000 to 250,000 System Gates Weak Pull-Up/-Down Up to 36 kbits of True Dual-Port SRAM IEEE 1149.1 (JTAG) Boundary Scan Test Up to 71 User I/Os Pin-Compatible Packages across the IGLOO Family Reprogrammable Flash Technology Clock Conditioning Circuit (CCC) and PLL 130-nm, 7-Layer Metal, Flash-Based CMOS Process Up to Six CCC Blocks, One with an Integrated PLL Instant On Level 0 Support Configurable Phase Shift, Multiply/Divide, Delay Single-Chip Solution Capabilities, and External Feedback Retains Programmed Design When Powered Off Wide Input Frequency Range (1.5 MHz up to 250 MHz) 250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System Performance Embedded Memory In-System Programming (ISP) and Security 1 kbit of FlashROM User Nonvolatile Memory SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM ISP Using On-Chip 128-Bit Advanced Encryption Standard Blocks (1, 2, 4, 9, and 18 organizations) (AES) Decryption via JTAG (IEEE 1532compliant) True Dual-Port SRAM (except 18 organization) FlashLock Designed to Secure FPGA Contents 1.2 V Programming Enhanced Commercial Temperature Range Tj = -20C to +85C 1 IGLOO nano Devices AGLN010 AGLN015 AGLN020 AGLN060 AGLN125 AGLN250 1 1 1 1 1 IGLOO nano-Z Devices AGLN030Z AGLN060Z AGLN125Z AGLN250Z System Gates 10,000 15,000 20,000 30,000 60,000 125,000 250,000 Typical Equivalent Macrocells 86 128 172 256 512 1,024 2,048 VersaTiles (D-flip-flops) 260 384 520 768 1,536 3,072 6,144 Flash*Freeze Mode (typical, W) 2 4 4 5 10 16 24 2 RAM Kbits (1,024 bits) 18 36 36 2 4,608-Bit Blocks 4 8 8 FlashROM Kbits (1,024 bits) 1 1 1 1 1 1 1 2 Secure (AES) ISP Yes Yes Yes 2,3 Integrated PLL in CCCs 1 1 1 VersaNet Globals 4 4 4 6 18 18 18 I/O Banks 2 3 3 2 2 2 4 Maximum User I/Os (packaged device) 34 49 52 77 71 71 68 Maximum User I/Os (Known Good Die) 34 52 83 71 71 68 Package Pins UC/CS UC36 UC81, UC81, CS81 CS81 CS81 CS81 QFN QN48 QN68 CS81 QN48, QN68 VQFP QN68 VQ100 VQ100 VQ100 VQ100 Notes: 1. Not recommended for new designs. 2. AGLN030 and smaller devices do not support this feature. 3. AGLN060, AGLN125, and AGLN250 in the CS81 package do not support PLLs. 4. For higher densities and support of additional features, refer to the IGLOO and IGLOOe datasheets. AGLN030 and smaller devices do not support this feature. June 2013 I 2013 Microsemi CorporationI/Os Per Package 1 IGLOO nano Devices AGLN010 AGLN015 AGLN020 AGLN060 AGLN125 AGLN250 1 1 1 1 1 IGLOO nano-Z Devices AGLN030Z AGLN060Z AGLN125Z AGLN250Z Known Good Die 34 52 83 71 71 68 UC36 23 QN48 3434 QN68 494949 UC81 5266 CS81 5266606060 VQ100 77717168 Notes: 1. Not recommended for new designs. 2. When considering migrating your design to a lower- or higher-density device, refer to the IGLOO datasheet and IGLOO FPGA Fabric Users Guide to ensure compliance with design and board migration requirements. 3. When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not used as a regular I/O, the number of single- ended user I/Os available is reduced by one. 4. indicates RoHS-compliant packages. Refer toIGLOO nano Ordering Informatio on page III for the location of the in the part number. For nano devices, the VQ100 package is offered in both leaded and RoHS-compliant versions. All other packages are RoHS-compliant only. Table 1 IGLOO nano FPGAs Package Sizes Dimensions Packages UC36 UC81 CS81 QN48 QN68 VQ100 Length Width (mm mm) 3 x 3 4 x 4 5 x 5 6 x 6 8 x 8 14 x 14 2 Nominal Area (mm ) 9 16 36 36 64 196 Pitch (mm) 0.4 0.4 0.5 0.4 0.4 0.5 Height (mm) 0.80 0.80 0.80 0.90 0.90 1.20 IGLOO nano Device Status IGLOO nano Devices Status IGLOO nano-Z Devices Status AGLN010 Production AGLN015 Not recommended for new designs. AGLN020 Production AGLN030Z Not recommended for new designs. AGLN060 Production AGLN060Z Not recommended for new designs. AGLN125 Production AGLN125Z Not recommended for new designs. AGLN250 Production AGLN250Z Not recommended for new designs. II Revision 17

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
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Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi
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