APT38M50J 500V, 38A, 0.10 Max N-Channel MOSFET Power MOS 8 is a high speed, high voltage N-channel switch-mode power MOSFET. A proprietary planar stripe design yields excellent reliability and manufacturability. Low switching loss is achieved with low input capacitance and ultra low CMille capaci- rss tance. The intrinsic gate resistance and capacitance of the poly-silicon gate structure UL Recognize help control slew rates during switching, resulting in low EMI and reliable paralleling, file E145592 IS OTO P even when switching at very high frequency. Reliability in yback, boost, forward, and D APT38M50J other circuits is enhanced by the high avalanche energy capability. Single die MOSFET G S FEATURES TYPICAL APPLICATIONS Fast switching with low EMI/RFI PFC and other boost converter Low R Buck converter DS(on) Ultra low C for improved noise immunity Two switch forward (asymmetrical bridge) rss Low gate charge Single switch forward Avalanche energy rated Flyback RoHS compliant Inverters Absolute Maximum Ratings Symbol Parameter Ratings Unit Continuous Drain Current T = 25C 38 C I D Continuous Drain Current T = 100C 24 A C 1 I Pulsed Drain Current 175 DM V Gate-Source Voltage 30 V GS E 2 1200 Single Pulse Avalanche Energy mJ AS I 28 AR Avalanche Current, Repetitive or Non-Repetitive A Thermal and Mechanical Characteristics Min Typ Max Unit Symbol Characteristic P Total Power Dissipation T = 25C W 357 D C R Junction to Case Thermal Resistance 0.35 JC C/W R Case to Sink Thermal Resistance, Flat, Greased Surface 0.15 CS T ,T Operating and Storage Junction Temperature Range C -55 150 J STG V V RMS Voltage (50-60hHz Sinusoidal Waveform from Terminals to Mounting Base for 1 Min.) 2500 Isolation oz 1.03 W T Package Weight g 29.2 inlbf 10 Torque Terminals and Mounting Screws. Nm 1.1 G S D S S OT-227 050-8075 Rev C 7-2011Static Characteristics T = 25C unless otherwise speci ed APT38M50J J Symbol Parameter Test Conditions Min Typ Max Unit V V = 0V, I = 250 A Drain-Source Breakdown Voltage 500 V BR(DSS) GS D V /T Reference to 25C, I = 250 A Breakdown Voltage Temperature Coef cient 0.60 V/C BR(DSS) J D V = 10V, I = 28A R 3 Drain-Source On Resistance 0.085 0.10 DS(on) GS D V Gate-Source Threshold Voltage 3 4 5 V GS(th) V = V , I = 2.5mA GS DS D V /T Threshold Voltage Temperature Coef cient -10 mV/C GS(th) J V = 500V T = 25C 100 DS J I Zero Gate Voltage Drain Current A DSS V = 0V T = 125C 500 GS J I V = 30V Gate-Source Leakage Current 100 nA GSS GS Dynamic Characteristics T = 25C unless otherwise speci ed J Symbol Parameter Test Conditions Min Typ Max Unit g V = 50V, I = 28A fs Forward Transconductance 42 S DS D C Input Capacitance 8800 iss V = 0V, V = 25V GS DS C Reverse Transfer Capacitance 120 rss f = 1MHz C Output Capacitance 945 oss pF 4 C Effective Output Capacitance, Charge Related 550 o(cr) V = 0V, V = 0V to 333V GS DS 5 C Effective Output Capacitance, Energy Related 275 o(er) Q Total Gate Charge 220 g V = 0 to 10V, I = 28A, GS D Q Gate-Source Charge 50 nC gs V = 250V DS Q Gate-Drain Charge gd 100 t Resistive Switching Turn-On Delay Time 38 d(on) t V = 333V, I = 28A Current Rise Time 45 r DD D ns 6 t R = 4.7 , V = 15V Turn-Off Delay Time 100 d(off) G GG t Current Fall Time 33 f Source-Drain Diode Characteristics Symbol Parameter Test Conditions Min Typ Max Unit Continuous Source Current D MOSFET symbol I S 38 showing the (Body Diode) integral reverse p-n A G Pulsed Source Current junction diode I SM 175 (body diode) 1 S (Body Diode) V I = 28A, T = 25C, V = 0V Diode Forward Voltage 1 V SD SD J GS 3 t I = 28A Reverse Recovery Time 660 ns rr SD Q di /dt = 100A/s, T = 25C Reverse Recovery Charge 13.2 C rr SD J I 28A, di/dt 1000A/ s, V = 333V, SD DD V/ns dv/dt Peak Recovery dv/dt 8 T = 125C J 1 Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature. 2 Starting at T = 25C, L = 3.06mH, R = 4.7, I = 28A. J G AS 3 Pulse test: Pulse Width < 380 s, duty cycle < 2%. 4 C is de ned as a xed capacitance with the same stored charge as C with V = 67% of V . o(cr) OSS DS (BR)DSS 5 C is de ned as a xed capacitance with the same stored energy as C with V = 67% of V . To calculate C for any value of o(er) OSS DS (BR)DSS o(cr) V less than V use this equation: C = -2.04E-7/V 2 + 4.76E-8/V + 1.36E-10. DS (BR)DSS, o(er) DS DS 6 R is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452) G Microsemi reserves the right to change, without notice, the speci cations and information contained herein. 050-8075 Rev C 7-2011