X-On Electronics has gained recognition as a prominent supplier of APT50M50JVFR Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. APT50M50JVFR Discrete Semiconductor Modules are a product manufactured by Microchip. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

APT50M50JVFR Microchip

APT50M50JVFR electronic component of Microchip
Images are for reference only
See Product Specifications
Part No.APT50M50JVFR
Manufacturer: Microchip
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules FG, FREDFET, 500V, 0.050_OHM, SOT-227
Datasheet: APT50M50JVFR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 77.0518 ea
Line Total: USD 77.05

Availability - 2
Ship by Fri. 02 Aug to Tue. 06 Aug
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2
Ship by Fri. 02 Aug to Tue. 06 Aug
MOQ : 1
Multiples : 1
1 : USD 74.681
500 : USD 68.8965
1000 : USD 67.8385
5000 : USD 66.2515

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Type
Vgs - Gate-Source Voltage
Mounting Style
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Configuration
Brand
Transistor Polarity
Fall Time
Id - Continuous Drain Current
Operating Supply Voltage
Pd - Power Dissipation
Product Type
Rds On - Drain-Source Resistance
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Vds - Drain-Source Breakdown Voltage
Vgs Th - Gate-Source Threshold Voltage
Cnhts
Hts Code
Mxhts
Taric
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the APT50M50JVFR from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the APT50M50JVFR and other electronic components in the Discrete Semiconductor Modules category and beyond.

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APT50M50JVFR 500V 77A 0.050 FREDFET POWER MOS V Power MOS V is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V also achieves faster switching speeds through optimized gate layout.UL Recognize ISOTOP Fast Recovery Body Diode 100% Avalanche Tested D FREDFET Lower Leakage Popular SOT-227 Package G Faster Switching S MAXIMUM RATINGS All Ratings: T = 25C unless otherwise specified. C Symbol Parameter APT50M50JVFR UNIT V Drain-Source Voltage 500 Volts DSS I Continuous Drain Current T = 25C 77 D C Amps 1 I Pulsed Drain Current 308 DM V Gate-Source Voltage Continuous 30 GS Volts V Gate-Source Voltage Transient 40 GSM Total Power Dissipation T = 25C 700 Watts C P D Linear Derating Factor 5.6 W/C T ,T Operating and Storage Junction Temperature Range -55 to 150 J STG C T Lead Temperature: 0.063 from Case for 10 Sec. 300 L 1 I Avalanche Current (Repetitive and Non-Repetitive) 77 Amps AR 1 E 50 Repetitive Avalanche Energy AR mJ 4 E Single Pulse Avalanche Energy 3600 AS STATIC ELECTRICAL CHARACTERISTICS Symbol Characteristic / Test Conditions MIN TYP MAX UNIT BV Drain-Source Breakdown Voltage (V = 0V, I = 250A) 500 Volts DSS GS D 2 I On State Drain Current (V > I x R Max, V = 10V) Amps 77 D(on) DS D(on) DS(on) GS 2 R Drain-Source On-State Resistance (V = 10V, 0.5 I ) Ohms 0.050 DS(on) GS D Cont. Zero Gate Voltage Drain Current (V = V , V = 0V) 250 DS DSS GS I A DSS Zero Gate Voltage Drain Current (V = 0.8 V , V = 0V, T = 125C) 1000 DS DSS GS C I Gate-Source Leakage Current (V = 30V, V = 0V) nA 100 GSS GS DS V Gate Threshold Voltage (V = V , I = 5mA) Volts 24 GS(th) DS GS D CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - APT50M50JVFR DYNAMIC CHARACTERISTICS Symbol Characteristic Test Conditions MIN TYP MAX UNIT C Input Capacitance 16300 19600 iss V = 0V GS C Output Capacitance 2210 3090 pF V = 25V oss DS C f = 1 MHz Reverse Transfer Capacitance 850 1275 rss 3 Q Total Gate Charge V = 10V 675 1000 g GS V = 0.5 V Q nC Gate-Source Charge 95 140 gs DD DSS I = I Cont. 25C Q Gate-Drain Mille) Charge D D 320 480 gd t (on) Turn-on Delay Time 25 50 d V = 15V GS t V = 0.5 V Rise Time 20 40 r DD DSS ns I = I Cont. 25C t (off) Turn-off Delay Time 85 125 d D D R = 0.6 t G Fall Time 12 24 f SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Symbol Characteristic / Test Conditions MIN TYP MAX UNIT Continuous Source Current (Body Diode) I 77 S Amps 1 I Pulsed Source Current (Body Diode) 308 SM 2 V Diode Forward Voltage (V = 0V, I = -I Cont. ) 1.3 Volts SD GS S D dv dv 5 Peak Diode Recovery / 5 V/ns / dt dt Reverse Recovery Time T = 25C 300 j ns t rr di (I = -I Cont. , / = 100A/s) S D dt T = 125C 600 j Reverse Recovery Charge T = 25C 2.2 j Q C rr di (I = -I Cont. , / = 100A/s) S D dt T = 125C 9.0 j Peak Recovery Current T = 25C 16 j I Amps RRM di (I = -I Cont. , / = 100A/s) S D dt T = 125C 33 j THERMAL/PACKAGE CHARACTERISTICS Symbol Characteristic MIN TYP MAX UNIT Junction to Case 0.18 R JC C/W R Junction to Ambient 40 JA V RMS Voltage (50-60 Hz Sinusoidal Waveform From Terminals to Mounting Base for 1 Min.) 2500 Volts Isolation Torque Maximum Torque for Device Mounting Screws and Electrical Terminations. 13 lbin 1 3 Repetitive Rating: Pulse width limited by maximum junction See MIL-STD-750 Method 3471 4 temperature. Starting T = +25C, L = 1.21mH, R = 25, Peak I = 77A j G L 2 5 di Pulse Test: Pulse width < 380 S, Duty Cycle < 2% I -I Cont. , / = 100A/s, V V , T 150C, R = 2.0, S D DD DSS j G dt V = 200V R APT Reserves the right to change, without notice, the specifications and information contained herein. 0.2 D=0.5 0.1 0.05 0.2 0.1 0.05 0.01 Note: 0.02 0.005 t 1 0.01 t SINGLE PULSE 2 t 1 Duty Factor D = / t 2 0.001 Peak T = P x Z + T J DM JC C 0.0005 -5 -4 -3 -2 -1 10 10 10 10 10 1.0 10 RECTANGULAR PULSE DURATION (SECONDS) FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION 050-5560 Rev C Z , THERMAL IMPEDANCE (C/W) JC P DM

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