mXT1066TD 1.0.AB maXTouch 1066-node Touchscreen Controller Product Brief Description The mXT1066TD 1.0.AB uses a unique charge-transfer acquisition engine to implement Microchips patented capacitive sensing method. Coupled with a state-of-the-art CPU, the entire touchscreen sensing solution can measure, classify and track a number of individual finger touches with a high degree of accuracy in the shortest response time. The mXT1066TD 1.0.AB allows for both mutual and self capacitance measurements, with the self capacitance measurements being used to augment the mutual capacitance measurements to produce reliable touch information. maXTouch Adaptive Sensing Touchscreen Touch Performance Technology Moisture/Water Compensation Up to 41 X (transmit) lines and 26 Y (receive) lines for - No false touch with condensation or water drop use by a touchscreen up to 22 mm diameter A maximum of 1066 nodes can be allocated to the - One-finger tracking with condensation or water touch sensor drop up to 22 mm diameter Touchscreen size of 12.4 inches (16:10 aspect ratio), Mutual capacitance and self capacitance assuming a sensor electrode pitch of 6.5 mm. Other measurements supported for robust touch detection sizes are possible with different electrode pitches and P2P mutual capacitance measurements supported for appropriate sensor material extra sensitive multi-touch sensing Multiple touch support with up to 16 concurrent Noise suppression technology to combat ambient, touches tracked in real time charger, and power-line noise Dual-boot OS support for Microsoft Windows and - Up to 240 V between 1 Hz and 1 kHz sinusoidal PP Android waveform - Up to 20 V between 1 kHz and 1 MHz PP Touch Sensor Technology sinusoidal waveform Discrete/out-cell support including glass and PET film- Stylus Support based sensors - Supports passive stylus with 1.5 mm contact On-cell/touch-on display support including TFT, LCD diameter, subject to configuration, stack-up, and (ITPS, IPS) and OLED sensor design Synchronization with display refresh timing capability Scan Speed Support for standard (for example, Diamond) and - Typical report rate for 10 touches 85 Hz (subject proprietary sensor patterns (review of designs by to configuration) Microchip or a Microchip-qualified touch sensor - Initial touch latency <20 ms for first touch from idle module partner is recommended) (subject to configuration) - Configurable to allow for power and speed Front Panel Material optimization Works with PET or glass, including curved profiles Touch panel failure detection (configuration and stack-up to be approved by - Automatic touch sensor diagnostics during run Microchip or a Microchip-qualified touch sensor time to support the implementation of safety module partner) critical features 10 mm glass (or 5 mm PMMA) with bare finger - Diagnostics reported using dedicated output pin (dependent on screen size, touch size, configuration or by standard Object Protocol messages and stack-up) - Configurable test limits 6 mm glass (or 3 mm PMMA) with multi-finger 5 mm glove (2.7 mm PMMA equivalent) (dependent on screen size, touch size, configuration and stack-up) 2021 Microchip Technology Inc. Product Brief DS40002295A-page 1 mXT1066TD 1.0.AB Enhanced Algorithms Lens bending algorithms to remove display noise Touch suppression algorithms to remove unintentional large touches, such as palm Palm Recovery Algorithm for quick restoration to normal state Product Data Store Area Up to 60 bytes of user-defined data can be stored during production Power Saving Programmable timeout for automatic transition from Active to Idle state Pipelined analog sensing detection and digital processing to optimize system power efficiency Application Interfaces 2 I C interface with support for Standard mode (up to 100 kHz), Fast mode (up to 400 kHz), Fast-mode Plus (up to 1 MHz), High Speed mode (up to 3.4 MHz) 2 HID-I C interface for Microsoft Windows 8.x and later versions Interrupt to indicate when a message is available Additional SPI Debug Interface to read the raw data for tuning and debugging purposes Power Supply Digital (Vdd) 3.3V nominal Digital I/O (VddIO) 1.8V nominal to 3.3V nominal Analog (AVdd) 3.3V nominal High voltage internal X line drive (XVdd) 6.6V or 9.9V with internal voltage pump Packages 114-ball UFBGA 7 5 0.65 mm, 0.5 mm pitch, High Density Interconnect 117-ball UFBGA 9.5 7 0.65 mm, 0.65 mm pitch, non-HDI package Operating Temperature 40 C to +85C Design Services Review of device configuration, stack-up and sensor patterns Custom firmware versions can be considered DS40002295A-page 2 Product Brief 2021 Microchip Technology Inc.