ATWILC1000-MR110xB IEEE 802.11 b/g/n Link Controller Module Introduction The ATWILC1000-MR110xB module is a low-power consumption IEEE 802.11 b/g/n IoT (Internet of Things) module, which is specifically optimized for low-power IoT applications. The ATWILC1000-MR110xB modules feature small form factor (21.7 mm x 14.7 mm x 2.1 mm) while fully integrating Power Amplifier (PA), Low Noise Amplifier (LNA), Transmit/Receive (T/R), switch and power management. The ATWILC1000-MR110PB includes a PCB antenna, whereas the ATWILC1000-MR110UB module includes a U.FL connector to use with an external antenna. With advanced security, it is interoperable with various vendors using IEEE 802.11b/g/n Access Points in wireless LAN. The module provides Serial Peripheral Interface (SPI) and Secure Digital Input Output (SDIO) to interface with the host controller. Notes: All references to the ATWILC1000-MR110xB module include all the modules listed below unless otherwise noted: ATWILC1000-MR110PB ATWILC1000-MR110UB Features Compliant with IEEE 802.11 b/g/n 20 MHz (1 x 1) Solution Supports Single Spatial Stream in 2.4 GHz ISM Band Integrated Power Amplifier (PA) and Transmit/Receive (T/R) Switch Superior Sensitivity and Range through Advanced PHY Signal Processing Advanced Equalization and Channel Estimation Advanced Carrier and Timing Synchronization Wi-Fi Direct and Soft-AP Support Supports IEEE 802.11 WEP, WPA, WPA2 and WPA2-Enterprise Security Superior Medium Access Control (MAC) Throughput through Hardware Accelerated Two-Level A-MSDU/A- MPDU Frame Aggregation and Block Acknowledgement On-Chip Memory Management Engine to Reduce the Host Load SPI and SDIO Host Interfaces Operating Temperature Ranges from -40C to +85C Input/Output Operating Voltage (VDDIO) of 1.62V to 3.6V Power supply for DC/DC Convertor (VBAT) has a range of 3.0V to 4.2V Built-In 26 MHz Crystal Power-Save Modes: <1 A Power-Down mode typical at 3.3V I/O 380 A Doze mode with chip settings preserved (used for beacon monitoring) On-chip low-power Sleep oscillator Fast host wake up from Doze mode by a pin or the host I/O transaction Wi-Fi Alliance certified for connectivity and optimizations ID: WFA65340 Datasheet DS70005326E-page 1 2015-2021 Microchip Technology Inc. ATWILC1000-MR110xB Table of Contents Introduction.....................................................................................................................................................1 Features......................................................................................................................................................... 1 1. Ordering Information and Module Marking..............................................................................................4 2. Functional Overview................................................................................................................................5 3. Pinout and Package Information............................................................................................................. 6 4. Electrical Specifications........................................................................................................................ 10 4.1. Absolute Ratings........................................................................................................................ 10 4.2. Recommended Operating Conditions........................................................................................ 10 4.3. DC Electrical Characteristics......................................................................................................10 4.4. Receiver Performance................................................................................................................12 4.5. Transmitter Performance............................................................................................................13 4.6. Timing Characteristics................................................................................................................15 5. Power Management..............................................................................................................................18 5.1. Current Consumption in Various Device States......................................................................... 18 5.2. Restrictions for Power States.....................................................................................................19 5.3. Power-Up/Down Sequence........................................................................................................19 5.4. Digital I/O Pin Behavior During Power-Up Sequences...............................................................20 6. CPU and Memory Subsystems............................................................................................................. 21 6.1. Processor................................................................................................................................... 21 6.2. Memory Subsystem....................................................................................................................21 6.3. Nonvolatile Memory (eFuse)...................................................................................................... 21 7. WLAN Subsystem................................................................................................................................. 23 7.1. MAC........................................................................................................................................... 23 7.2. PHY............................................................................................................................................24 7.3. Radio..........................................................................................................................................24 8. External Interfaces................................................................................................................................ 26 8.1. Interfacing with the Host Microcontroller.................................................................................... 26 8.2. SPI Client Interface.................................................................................................................... 27 8.3. SDIO Client Interface................................................................................................................. 28 8.4. UART Debug Interface...............................................................................................................29 2 8.5. I C Client Interface..................................................................................................................... 29 9. Notes on Interfacing with the ATWILC1000-MR110xB..........................................................................31 10. Reference Design................................................................................................................................. 32 11. Module Outline Drawings...................................................................................................................... 34 12. Design Consideration............................................................................................................................37 12.1. ATWILC1000-MR110PB Placement and Routing Guidelines.................................................... 37 12.2. Printed PCB Antenna Performance of ATWILC1000-MR110PB................................................38 DS70005326E-page 2 Datasheet 2015-2021 Microchip Technology Inc.