Revision 5 ex Automotive Family FPGAs Live on Power-Up Specifications No Power-Up/Down Sequence Required for Supply 3,000 to 12,000 Available System Gates Voltages Maximum 512 Flip-Flops (Using CC Macros) Configurable Weak Resistor Pull-Up or Pull-Down for 0.22 m CMOS Process Technology Tristated Outputs during Power-Up Up to 132 User-Programmable I/O Pins Individual Output Slew-Rate Control 2.5 V and 3.3 V I/Os Software Design Support with Designer and Libero Features Integrated Design Environment (IDE) Tools 250MHz Internal Performance, Low-Power Antifuse Up to 100% Resource Utilization with 100% Pin Locking FPGA Deterministic Timing Advanced Small-Footprint Packages Unique In-System Diagnostic and Verification Capability Pin-to-Pin Compatibility with eX Commercial- and with Silicon Explorer II Industrial-Grade Devices Boundary Scan Testing in Compliance with IEEE Hot-Swap Compliant I/Os Standard 1149.1 (JTAG) Single-Chip Solution FuseLock Secure Programming Technology Designed to Prevent Reverse Engineering and Design Theft Nonvolatile Product Profile Device eX64 eX128 eX256 Capacity 3,000 6,000 12,000 System Gates 2,000 4,000 8,000 Typical Gates Register Cells Dedicated Flip-Flops 64 128 256 Maximum Flip-Flops 128 256 512 Combinatorial Cells 128 256 512 Maximum User I/Os 84 100 132 Global Clocks Hardwired 1 1 1 Routed 2 2 2 Speed Grades* Std. Std. Std. Temperature Grades* A A A Package (by pin count) TQ 64, 100 64, 100 100 CS 49, 128 49, 128 128, 180 Note: * The eX family is also offered in commercial and industrial temperature grades with F, P, and Std. speed grades. Refer to the eX Family FPGAs datasheet for more details. October 2012 i 2012 Microsemi CorporationOrdering Information eX128 TQ G 100 A Application (Ambient Temperature Range) A = Automotive (-40C to 125C) Blank = Commercial (0C to 70C) I = Industrial (-40C to 85C) Package Lead Count Lead-Free Packaging Blank = Standard Packaging G = RoHS Compliant Packaging Package Type = TQ Thin Quad Flat Pack (1.4mm pitch) = CS Chip-Scale Package (0.8mm pitch) Speed Grade Blank= Standard Speed P= Approximately 30% Faster than Standard F= Approximately 40% Slower than Standard Part Number eX64 = 64 Dedicated Flip-Flops (3,000 System Gates) eX128 = 128 Dedicated Flip-Flops (6,000 System Gates) eX256 = 256 Dedicated Flip-Flops (12,000 System Gates) Note: Automotive grade parts (A grade) devices are tested at room temperature to specifications that have been guard banded based on characterization across the recommended operating conditions. A-grade parts are not tested at extended temperatures. If testing to ensure guaranteed operation at extended temperatures is required, please contact your local Microsemi SoC Products Group Sales office to discuss testing options available. Plastic Device Resources User I/Os (Including Clock Buffers) Device TQ 64 TQ100 CS49 CS128 CS180 eX64 41 56 36 84 eX128 46 70 36 100 eX256 81 100 132 Note: Package Definitions:TQ = Thin Quad Flat Pack, CS = Chip Scale Package Speed Grade and Temperature Grade Matrix Std. A Note: Refer to the eX Family FPGAs datasheet for more details on commercial- and industrial-grade offerings. Contact your local Microsemi SoC Products Group representative for device availability. ii Revision 5