Product Information

HV53001-E/KWX

HV53001-E/KWX electronic component of Microchip

Datasheet
Serial to Parallel Logic Converters 16-Ch +/- Push Pull with Current Sense and Boost

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 12.673 ea
Line Total: USD 12.67

240 - Global Stock
Ships to you between
Thu. 23 May to Mon. 27 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
240 - WHS 1


Ships to you between Thu. 23 May to Mon. 27 May

MOQ : 1
Multiples : 1

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HV53001-E/KWX
Microchip

1 : USD 12.673
25 : USD 11.04
100 : USD 10.097

     
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HV53001 16-Channel, 135V Push-Pull Driver with RTZ, Current Sensor and Built-in Boost Converter Features General Description 16-Channel Push-Pull Output The HV53001 device is an integrated driver solution for various applications, which consists of three main Return-To-Zero (RTZ) and High-Impedance (Hi-Z) functional blocks (1) high-voltage driver, (2) SPI inter- Function face and (3) DC/DC boost controller with power Up to 135V Output Voltage MOSFET. 24 mA Minimum Source Sink Output Current The high-voltage driver block includes 16 push-pull 250 pF Maximum Output Load drivers capable of 135V output swing with Return-To- Current Sensor Output Zero (RTZ) function. Each output driver is capable of SPI Interface with Quad-Latched 2-bit per Chan- sourcing and sinking at least 24 mA. Each high-volt- nel Architecture age output is capable of driving up to 250 pF capaci- Power-on Reset Function tive load. A global current sensor function is also integrated into this device to monitor the charge and DC/DC Boost Converter with Power MOSFET discharge currents. The measured current is mapped 2.7 to 5.5V Converter Input Voltage to a low-voltage analog output with a scale factor of Short Circuit Protection 3.1 V/V via a current sensing resistor. Overtemperature Monitor The SPI interface is used to communicate between the Power ON/OFF Sequence Control host processor and the high-voltage drivers. This inter- Shutdown Function face accepts a 3.3V logic I/O signal up to clock speed 105-ball 9 x 9 mm TFBGA Package of 32 MHz. Five digital LATCH control signals manage the data flow and the firing pattern. It establishes the Application output to one of four possible states: V , V , 0V or PP NN high impedance. Surface Haptic Application This IC also includes an integrated DC/DC controller MEMS Driver with power MOSFET. The controller is used in a fly- Piezo Driver back configuration to generate four high-voltage rails, 135V and 123V, for the high-voltage driver block. The 123V rails are created from two 12V floating sup- plies referenced to the 135V supply rails. The converter accepts input voltage from a single 2.7V-5.5V input voltage rail. A built-in positive charge pump and a simple external negative charge pump convert the input supply to +6.5V and -6.0V supplies to power the high-voltage driver block. A proper power on and off sequence is critical to ensure the operation of the high-voltage driver. A power sequence control circuit is included for the user to con- trol the power supplies to power up or down the high- voltage driver. It is used in conjunction with the external high-voltage FET transistors. Safety features are added to the DC/DC converter. The overvoltage protection monitors both high-voltage rails to protect the driver against an overvoltage condition. Short circuit protection detects any short circuit event at the high-voltage rails by monitoring the current flow 2021 Microchip Technology Inc. DS20006518A-page 1HV53001 through the power FET transistor. When a short circuit The HV53001 device is packaged in a 9x9mm 105 ball is detected, the DC/DC controller will shut down the TFBGA package. All high-voltage I/Os are arranged to converter and send a fault signal at the SHORT pin. have sufficient clearance for safety. An overtemperature monitor function is also added in the converter IC. It sends a fault signal at the TEMP pin when it detects a temperature over the threshold temperature. Typical Application Diagram 2.7 to 12V -VE LDO LVGND HVGND +VE LDO VBOVP VBFB RSHT 2.7V to 5.5V Logic voltage supply V V V SHTN SHTP S D OVPP OVPN FBP FBN V VPF VPP VNN VNNO VPPO FILN FILP DD CC IN NF VLL CCP2 Sensor Circuit POWER VNNSENSE Power On MOSFET Sequence VPPSENSE POR Control GATE actuator CHARGE DRIVER CCP1 PUMP High Voltage REGULATOR Overvoltage LATCHIN HVOUT0 DC/DC Protection VSSPUL CONTROLLER LATCHA VSS Control LATCHB Short Circuit Logic VBFB Low Voltage Protection LATCHC VBOVP VSSPUL REF HVOUT15 Driver LATCHD HV53001 EN TON SPI Temp VREF Interface Sensor STDBY VLDO AGND SHORT SHTEN RT TEMP TRIG SEQ 0:3 SHDN SDI SDO SCK SS HVGND PGND CONTROL FROM MCU DATA FROM MCU DS20006518A-page 2 2021 Microchip Technology Inc. LATCHIN LATCHA LATCHB LATCHC LATCHD Rsense Rsense

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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