JANTXV1N5804 Microchip

WWW.Microsemi .COM 1N5802 1N5806 1N5802 thru 1N5806 VOIDLESS-HERMETICALLY-SEALED ULTRAFAST RECOVERY GLASS SCOTTSDALE DIVISION RECTIFIERS APPEARANCE DESCRIPTION These Ultrafast Recovery rectifier diodes are military qualified to MIL-PRF-19500/477 and are ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 2.5 Amp rated rectifiers for working peak reverse voltages from 50 to 150 volts are hermetically sealed with voidless-glass construction using an internal Category I metallurgical bond. They are also available in surface-mount packages (see separate data sheet for 1N5802US thru 1N5806US). Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including standard, fast and ultrafast in thru-hole and surface- A Package mount packages. IMPORTANT: For the most current data, consult MICROSEMIs website: WWW.Microsemi .COM 1N5802 1N5806 1N5802 thru 1N5806 VOIDLESS-HERMETICALLY-SEALED ULTRAFAST RECOVERY GLASS SCOTTSDALE DIVISION RECTIFIERS SYMBOLS & DEFINITIONS Symbol Definition V Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current BR Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature V RWM range Average Rectified Output Current: Output Current Averaged over a full cycle with a 50 Hz or 60 Hz sine-wave I O input and a 180 degree conduction angle V Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current F I Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and temperature R Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage C Reverse Recovery Time: The time interval between the instant the current passes through zero when changing t from the forward direction to the reverse direction and a specified recovery decay point after a peak reverse rr current occurs. GRAPHS FIGURE 1 OUTPUT CURRENT vs. LEAD TEMP. PACKAGE DIMENSIONS inches/[mm] NOTE: Lead tolerance = +0.002/-0.003 inches Copyright 2007 Microsemi Page 2 1-15-2007 REV A Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503