BAS21T-TP Micro Commercial Components (MCC)

BAS21T Features Fast Switching Speed Ultra-Small Surface Mount Package High Conductance 150mW 85Volt For General Purpose Switching Applications Switching Diode Halogen Free. Green Device (Note 1) Moisture Sensitivity Level 1 Epoxy Meets UL 94 V-0 Flammability Rating Maximum Ratings Operating Junction Temperature Range: -65C to +150C Storage Temperature Range: -65C to +150C Peak Repetitive MCC Device Reverse Voltage SOT-523 Part Number Marking V RRM BAS21T T3 250V A Average Rectified D I 200mA o Output Current C B t=1.0us Peak Forward Surge 9.0A I FSM t=1.0s Current 0.5A E Power Dissipation P 150mW D G H J Electrical Characteristics 25C Unless Otherwise Specified K I =100.0mA DIMENSIONS Maximum Forward 1.000V F V F INCHES MM I =250.0mA Voltage 1.250V F DIM NOTE MIN MAX MIN MAX A 0.059 0.067 1.50 1.70 B 0.030 0.033 0.75 0.85 Maximum DC 0.057 0.069 1.45 1.75 C Reverse Current At 0.020 Nominal 0.50 Nominal D V =250V I 100nA R R Rated DC Blocking E 0.035 0.043 0.90 1.10 Voltage G 0.000 0.004 0.00 0.10 H 0.024 0.031 0.60 0.80 Typical Junction V =0.0V,f=1.0MHz J 0.004 0.008 0.10 0.20 C 5pF R T Capacitance K 0.006 0.014 0.15 0.35 I =30mA, I =30mA Reverse Recovery F R Suggested Solder Pad Layout t 50nS rr Time I =0.1*I R =100 rr R c (mm) Note: 1. Halogen freeGreen products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Internal Structure Rev.3-4-10252021 1/3 MCCSEMI.COMBAS21T Curve Characteristics Fig. 1 - Typical Instantaneous Forward Characteristics Fig. 2 - Typical Reverse Leakage Characteristics 1000 1000 100 T =100C A T =100C A 100 10 T =25C 1 A 10 T =25C A 0.1 1 0.01 0 40 80 120 160 200 0.0 0.4 0.8 1.2 1.6 2.0 Reverse Voltage (V) Instantaneous Forward Voltage (V) Fig. 3 - Power Derating Curve 200 150 100 50 0 0 25 50 75 100 125 150 Ambient Temperature (C) Rev.3-4-10252021 2/3 MCCSEMI.COM Power Dissipation (mW) Instantaneous Forward Current (mA) Instantaneous Reverse Leakage Current (nA)