ES2B-TP Micro Commercial Components (MCC)

NOT RECOMMENDED FOR NEW DESIGNS USE ES2A-LTP~ES1J-LTP SERIES MCC ES2A omponents TM 20736 Marilla Street Chatsworth THRU Micro Commercial Components ES2M Features Halogen free available upon request by adding suffix-H Lead Free Finish/Rohs Compliant (Note1) Suffix designates 2 Amp Ultra Fast Compliant. See ordering information) Epoxy meets UL 94 V-0 flammability rating Recovery Moisture Sensitivity Level 1 Easy Pick And Place Silicon Rectifier High Temp Soldering: 260C for 10 Seconds At Terminals 50 to 1000 Volts Superfast Recovery Times For High Efficiency Maximum Ratings DO-214AC Operating Temperature: -50C to +150C Storage Temperature: -50C to +150C (HSMA) (High Profile) Maximum Thermal Resistance 20C/W Junction To Lead H MCC Device Maximum Maximum Maximum Cathode Band Catalog Marking Recurrent RMS DC Number Peak Reverse Voltage Blocking J Voltage Voltage ES2A ES2A 50V 35V 50V ES2B ES2B 100V 70V 100V ES2C ES2C 150V 105V 150V A ES2D ES2D 200V 140V 200V C ES2G ES2G 400V 280V 400V E ES2J ES2J 600V 420V 600V D B F ES2K ES2K 800V 560V 800V ES2M ES2M 1000V 700V 1000V G Electrical Characteristics 25C Unless Otherwise Specified DIMENSIONS Average Forward I 2.0A F(AV) T = 75C J INCHES MM DIM MIN MAX MIN MAX NOTE Current A .078 .116 1.98 2.95 Peak Forward Surge I 50A 8.3ms, half sine B .067 .089 1.70 2.25 FSM C .002 .008 .05 .20 Current D --- .02 --- .51 E .035 .055 .89 1.40 Maximum F .065 .096 1.65 2.45 G .205 .224 5.21 5.69 Instantaneous H .160 .180 4.06 4.57 J .100 .112 2.57 2.84 Forward Voltage ES2A-D .975V V I = 2.0A F FM ES2G-J 1.35V ES2K-M 1.70V T = 25C* J SUGGESTED SOLDER PAD LAYOUT Maximum DC 0.090 Reverse Current At I R 5A T = 25C J Rated DC Blocking 150A T = 100C J Voltage Maximum Reverse 0.085 Recovery Time ES2A-D 50ns T I =0.5A, I =1.0A, rr F R ES2G-J 60ns I =0.25A ES2K-M 100ns rr 0.070 Typical Junction C 25pF Measured at J Capacitance 1.0MHz, V =4.0V R *Pulse test: Pulse width 200 sec, Duty cycle 2% Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7. www.mccsemi.com Revision: C 2013/01/01 1 of 4ES2A thru ES2M MCC TM Figure 1 Typical Forward Characteristics Micro Commercial Components 20 Figure 2 Forward Derating Curve 10 2.4 6 2.2 4 2.0 1.8 2 1.6 25C 1 1.4 Amps 1.2 .6 Amps 1.0 .4 .8 .6 .2 .4 Single Phase, Half Wave .1 .2 60Hz Resistive or Inductive Load .06 0 25 50 75 100 125 150 0 .04 C .02 Average Forward Rectified Current - Amperesversus Ambient Temperature - C .01 .2 .4 .6 .8 1.0 1.2 Volts Instantaneous Forward Current - Amperes versus Instantaneous Forward Voltage - Volts Figure 3 Junction Capacitance 100 60 40 20 T =25C J pF 10 6 4 2 1 400 1000 .1 .2 .4 1 2 4 10 20 40 100 200 Volts Junction Capacitance - pF versus Reverse Voltage - Volts www.mccsemi.com Revision: C 2013/01/01 2 of 4