MCC omponents TM 20736 Marilla Street Chatsworth MMBZ5221B Micro Commercial Components THRU MMBZ5259B Features Halogen free available upon request by adding suffix-H Lead Free Finish/RoHS Compliant Suffix designates RoHS Compliant. See ordering information) 350 mW Epoxy meets UL 94 V-0 flammability rating Moisture Sensitivity Level 1 Zener Diode Wide Voltage Range Available Small Outline Package For Space Savings 2.4 to 39 Volts High Temp Soldering: 260C for 10 Seconds At Terminals Surface Mount Package Maximum Ratings SOT-23 Operating Junction Temperature: -55C to +150C A Storage Temperature: -55C to +150C D Maximum Thermal Resistance 357C/W Junction To Ambient o B C Maximum Ratings 25 C Unless Otherwise Specified Zener Current I 100 mA F E Maximum Forward V 1.2 V F Voltage Power Dissipation P d 350 mWatt (Notes A) F G H Pe ak Forward Surge IFSM 4.0 Amps J K Current (Notes B) DIMENSIONS NOTES: INCHES MM DIM MIN MAX MIN MAX NOTE A .110 .119 2.80 3.00 A. Mounted on FR4 PC board with our suggested solder pad layout . B.086 .103 2.202.60 B. Measured on 8.3ms, single half sine-wave or equivalent C .047 .056 1.20 1.40 D.033 .041 .85 1.05 square wave, duty cycle = 4 pulses per minute maximum. E.066 .083 1.70 2.10 F --- .006 --- .15 G.035 .044 .90 1.10 H.002 .006 .05 .15 J.013.020 .35 .50 K.007 --- .20 --- Suggested Solder Pad Layout .035 .900 .055 *Pin Configuration - Top View 1.40 .102 inches 2.60 mm .035 .880 .035 .880 www.mccsemi.com Revision: B 2013/01/01 1 of 5MMBZ5221B thru MMBZ5259B MCC TM Micro Commercial Components ELECTRICAL CHARACTERISTICS 25 C q MCC NOMINAL ZENER TEST CURRENT MAXIMUM ZENER IMPEDANCE MAXIMUM REVERSE LEAKAGE MARKING PART VOLTAGE V I I B SUFFIX ONLY CURRENT Z ZT ZT NUMBER Z I Z I = 0.25mA I V ZT ZT ZK ZK R R VOLTS mA OHMS OHMS P A VOLTS MMBZ5221B KC1/C1 2.4 20 30 1200 100 1.0 MMBZ5222B KC2/C2 2.5 20 30 1250 100 1.0 MMBZ5223B KC3/C3 2.7 20 30 1300 75 1.0 MMBZ5225B KC5/C5 3.0 20 29 1600 50 1.0 MMBZ5226B KG1/D1 3.3 20 28 1600 25 1.0 MMBZ5227B KG2/D2 3.6 20 24 1700 15 1.0 MMBZ5228B KG3/D3 3.9 20 23 1900 10 1.0 MMBZ5229B KG4/D4 4.3 20 22 2000 5.0 1.0 MMBZ5230B KG5/D5 4.7 20 19 1900 5.0 2.0 MMBZ5231B KE1/E1 5.1 20 17 1600 5.0 2.0 MMBZ5232B KE2/E2 5.6 20 11 1600 5.0 3.0 MMBZ5233B KE3/E3 6.0 20 7.0 1600 5.0 3.5 MMBZ5234B KE4/E4 6.2 20 7.0 1000 5.0 4.0 MMBZ5235B KE5/E5 6.8 20 5.0 750 3.0 5.0 MMBZ5236B KF1/F1 7.5 20 6.0 500 3.0 6.0 MMBZ5237B KF2/F2 8.2 20 8.0 500 3.0 6.5 MMBZ5238B KF3/F3 8.7 20 8.0 600 3.0 6.5 MMBZ5239B KF4/F4 9.1 20 10 600 3.0 7.0 MMBZ5240B KF5/F5 10 20 17 600 3.0 8.0 MMBZ5241B KH1/H1 11 20 22 600 2.0 8.4 MMBZ5242B KH2/H2 12 20 30 600 1.0 9.1 MMBZ5243B KH3/H3 13 9.5 13 600 0.5 9.9 MMBZ5244B KH4/H4 14 9.0 15 600 0.1 10 MMBZ5245B KH5/H5 15 8.5 16 600 0.1 11 MMBZ5246B KJ1/J1 16 7.8 17 600 0.1 12 MMBZ5248B KJ3/J3 18 7.0 21 600 0.1 14 MMBZ5250B KJ5/J5 20 6.2 25 600 0.1 15 MMBZ5251B KK1/K1 22 5.6 29 600 0.1 17 MMBZ5252B KK2/K2 24 5.2 33 600 0.1 18 MMBZ5254B KK4/K4 27 5.0 41 600 0.1 21 MMBZ5255B KK5/K5 28 4.5 44 600 0.1 21 MMBZ5256B KM1/M1 30 4.2 49 600 0.1 23 MMBZ5257B KM2/M2 33 3.8 58 700 0.1 25 MMBZ5258B KM3/M3 36 3.4 70 700 0.1 27 MMBZ5259B KM4/M4 39 3.2 80 800 0.1 30 Note: 1.Tolerance and Type Number Designation. The type numbers listed have a standard tolerance on the nominal zener voltage of 5%. 2.Specials Available Include: A. Nominal zener voltages between the voltages shown and tighter voltage tolerances. B. Matched sets. O 3.Zener Voltage (VZ) Measurement. Guarantees the zener voltage when measured at 90 seconds while maintaining the lead temperature (TL) at 30 C, from the diode body. 4.Zener Impedance (ZZ) Derivation. The zener impedance is derived from the 60 cycle ac voltage, which results when an AC current having an rms value equal to 10% of the dc zener current (IZT or IZK) is superimposed on IZT or IZK. 5.Surge Current (IR) Non-Repetitive. The rating listed in the electrical characteristics table is maximum peak, non-repetitive, reverse surge current of 1/2 square wave or equivalent sine wave pulse of 1/120 second duration superimposed on the test current, IZT, per JEDEC registration however, actual device capability is as described in Figure 5. www.mccsemi.com Revision: B 2013/01/01 2 of 5